NCP5304DR2G ON Semiconductor, NCP5304DR2G Datasheet - Page 16

• Manufacturer Part Number: NCP5304DR2G
• Description: IC DRIVER HI/LOW SIDE HV 8-SOIC
• Manufacturer: ON Semiconductor
• Type: High Side/Low Sider

Specifications of NCP5304DR2G

• Configuration: Half Bridge
• Input Type: Non-Inverting
• Delay Time: 100ns
• Current - Peak: 250mA
• Number Of Configurations: 1
• Number Of Outputs: 2
• High Side Voltage - Max (bootstrap): 600V
• Voltage - Supply: 10 V ~ 20 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Rise Time: 160 ns
• Fall Time: 75 ns
• Supply Voltage (min): 10 V
• Supply Current: 5 mA
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Bridge Type: Full Bridge, Half Bridge
• Number Of Drivers: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PUBLICATION ORDERING INFORMATION
The product described herein is covered by U.S. patents: 6,097,075; 7,176,723; 6,362,067. There may be some other patents pending.
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ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,
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SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
NOTE 2
SEATING
PLANE
−T−
H
8
1
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
F
−A−
G
5
4
0.13 (0.005)
D
N
−B−
C
M
K
T
A
PACKAGE DIMENSIONS
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
M
http://onsemi.com
B
CASE 626−05
M
8 LEAD PDIP
ISSUE L
16
L
M
J
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loca
Sales Representative
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
3. DIMENSIONING AND TOLERANCING PER ANSI
FORMED PARALLEL.
SQUARE CORNERS).
Y14.5M, 1982.
DIM
A
B
C
D
G
H
K
M
N
F
J
L
MILLIMETERS
MIN
9.40
6.10
3.94
0.38
1.02
0.76
0.20
2.92
0.76
---
2.54 BSC
7.62 BSC
10.16
MAX
6.60
4.45
0.51
1.78
1.27
0.30
3.43
1.01
10
_
NCP5304/D
0.370
0.240
0.155
0.015
0.040
0.030
0.008
0.030
0.115
MIN
---
0.100 BSC
0.300 BSC
INCHES
0.400
0.260
0.175
0.020
0.070
0.050
0.012
0.135
0.040
MAX
10
_