NCP5304DR2G ON Semiconductor, NCP5304DR2G Datasheet - Page 3

no-image

NCP5304DR2G

Manufacturer Part Number
NCP5304DR2G
Description
IC DRIVER HI/LOW SIDE HV 8-SOIC
Manufacturer
ON Semiconductor
Type
High Side/Low Sider
Datasheet

Specifications of NCP5304DR2G

Configuration
Half Bridge
Input Type
Non-Inverting
Delay Time
100ns
Current - Peak
250mA
Number Of Configurations
1
Number Of Outputs
2
High Side Voltage - Max (bootstrap)
600V
Voltage - Supply
10 V ~ 20 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Rise Time
160 ns
Fall Time
75 ns
Supply Voltage (min)
10 V
Supply Current
5 mA
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Bridge Type
Full Bridge, Half Bridge
Number Of Drivers
2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NCP5304DR2G
Manufacturer:
ON
Quantity:
2 345
Company:
Part Number:
NCP5304DR2G
Quantity:
4 500
Company:
Part Number:
NCP5304DR2G
Quantity:
131
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
MAXIMUM RATINGS
PIN DESCRIPTIONS
V
Pin No.
BOOT−
V
dV
1
2
3
4
5
6
7
8
CC_transient
V
V
V
V
Rating
BRIDGE
V
T
BRIDGE
BRIDGE
DRV_LO
DRV_HI
R
V
J_max
IN_XX
qJA
CC
V
BRIDGE
/dt
Pin Name
DRV_LO
BRIDGE
DRV_HI
VBOOT
IN_LO
IN_HI
GND
VCC
Main power supply voltage
Main transient power supply voltage:
VHV: High Voltage BRIDGE pin
Allowable Negative Bridge Pin Voltage for IN_LO Signal Propagation to DRV_LO
(see characterization curves for detailed results)
VHV: Floating supply voltage
VHV: High side output voltage
Low side output voltage
Allowable output slew rate
Inputs IN_HI, IN_LO
ESD Capability:
− HBM model (all pins except pins 6−7−8 in 8 pins
− Machine model (all pins except pins 6−7−8 in 8 pins
Latch up capability per Jedec JESD78
Power dissipation and Thermal characteristics
PDIP−8: Thermal Resistance, Junction−to−Air
SO−8: Thermal Resistance, Junction−to−Air
Maximum Operating Junction Temperature
IV
package or 11−12−13 in 14 pins package)
package or 11−12−13 in 14 pins package)
CC_max
Logic Input for Low side driver output in phase
Logic Input for High side driver output in phase
Low side and main power supply
Ground
Low side gate drive output
Bootstrap return or High side floating supply return
High side gate drive output
Bootstrap power supply
= 5 mA during 10 ms
Symbol
http://onsemi.com
3
Pin Function
−0.3 to V
−1.0 to V
V
BRIDGE
V
−0.3 to 20
−0.3 to 20
−1 to 600
BOOT
Value
+150
−10
200
100
178
23
50
2
CC
CC
− 0.3 to
+ 0.3
+ 0.3
+ 0.3
°C/W
V/ns
Unit
kV
°C
V
V
V
V
V
V
V
V
V

Related parts for NCP5304DR2G