MX879R IXYS, MX879R Datasheet - Page 78

• Manufacturer Part Number: MX879R
• Description: IC DVR RELAY/LOAD 8CH 60V 28-QFN
• Manufacturer: IXYS

Specifications of MX879R

• Input Type: Parallel/Serial
• Number Of Outputs: 8
• Current - Output / Channel: 120mA
• Voltage - Supply: 6 V ~ 60 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-QFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• On-state Resistance: -
• Current - Peak Output: -

MXEI2240
240 Output ePaper Gate Driver
Features
• CMOS Technology
• Drives Segment or Active Matrix Displays
• 16 to 57.5 Volt Output Drive
• Selectable Output Shift Direction andPolarity
• 3 Output Switching Modes
• Cascadable (4 Maximum)
Applications
• eBooks / eReaders
• Electronic Shelf Labels / Point Of Purchase Displays
• Mobile Phones / Portable Hand Held Devices
• Smart Cards
• Signage
Ordering Information
Block Diagram
56
MODE1
MODE2
WALK0
TEST1
Part No.
MXEI2240WB
MXEI2240XB
SPV
CKV
CE1
CE2
R/L
controller
diodes
Description
Gold Bumped Die / Wafer Form
Gold Bumped Die / Waffle Pack
ESD
generator
V
BIAS
Vdd
Vee
LS/amp
buffer/
driver
OG1
bit1
Shift register/pulse generator
Vdd
Vee
LS/amp
buffer/
driver
OG2
bit2
...
...
...
Vdd
Vee
LS/amp
buffer/
driver
OG240
bit240
General Description
The MXEI2240 is a 240 bit serial shift register, level translator,
and high voltage buffered driver. The shift register is ‘seeded’
by the CE1, CE2, R/L, SPV, and CKV inputs.
The output pulse pattern is selected with the MODE1 and
MODE2 inputs. A one pulse, continuous two pulse, jumping two
pulse, or no pulse pattern can be generated. Pulse polarity is
selected with the WALK0 input.
The register output bits are amplified rail-rail from V
the output strength of the buffer drivers is modulated by the
Vbias generator. This allows the OGn outputs to be continuously
optimized for peak performance while minimizing transients
over a wide operating range.
The MXEI2240 is designed to operate over a temperature range
of -40°C to +85°C, and is available as Gold Bumped Die in Wafer
Form or Waffle Pack.
EE
to V
DD
, and