BUK135-50L,118 NXP Semiconductors, BUK135-50L,118 Datasheet - Page 12

• Manufacturer Part Number: BUK135-50L,118
• Description: TOPFET LOGIC LVL 50V D2PAK
• Manufacturer: NXP Semiconductors
• Series: TOPFET™r
• Type: Low Sider

Specifications of BUK135-50L,118

• Input Type: Non-Inverting
• Number Of Outputs: 1
• On-state Resistance: 21 mOhm
• Current - Output / Channel: 30A
• Current - Peak Output: 44A
• Mounting Type: Surface Mount
• Package / Case: D²Pak, TO-263 (4 leads + tab)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Operating Temperature: -
• Other names: 934056337118; BUK135-50L /T3; BUK135-50L /T3

Philips Semiconductors
MECHANICAL DATA
1 Epoxy meets UL94 V0 at 1/8". Net mass: 1.5 g.
July 2002
Logic level TOPFET
SMD version of BUK124-50L
For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18.
Plastic single-ended surface mounted package (Philips version of D
(one lead cropped)
DIMENSIONS (mm are the original dimensions)
UNIT
mm
Fig.36. SOT426 surface mounting package
OUTLINE
VERSION
SOT426
4.50
4.10
A
H D
1.40
1.27
A 1
D
D 1
0.85
0.60
b
IEC
1
0.64
0.46
c
e
max.
11
D
2
e
E
JEDEC
1.60
1.20
3
D 1
4
e
REFERENCES
10.30
e
9.70
E
0
5
1.70
b
e
scale
EIAJ
12
2.5
1
2.90
2.10
L p
, centre pin connected to mounting base.
5 mm
15.80
14.80
H D
2.60
2.20
mounting
2
Q
-PAK); 5 leads
base
L p
A 1
Q
PROJECTION
c
EUROPEAN
A
ISSUE DATE
98-12-14
99-06-25
Product Specification
BUK135-50L
SOT426
Rev 1.100