TPD4123AK(Q) Toshiba, TPD4123AK(Q) Datasheet - Page 12

• Manufacturer Part Number: TPD4123AK(Q)
• Description: IC SGL CHIP INV 500V 1A 26-DIP
• Manufacturer: Toshiba

Specifications of TPD4123AK(Q)

• Applications: DC Motor Driver, Brushless (BLDC), 3 Phase
• Number Of Outputs: 1
• Current - Output: 1A
• Voltage - Load: 50 V ~ 450 V
• Voltage - Supply: 13.5 V ~ 16.5 V
• Operating Temperature: -40°C ~ 135°C
• Mounting Type: Through Hole
• Package / Case: 32-DIP (0.654", 16.6mm), 26 leads
• Motor Type: DC Brushless
• No. Of Outputs: 1
• Output Current: 1A
• Output Voltage: 2.4V
• Supply Voltage Range: 13.5V To 16.5V, 50V To 450V
• Driver Case Style: DIP
• No. Of Pins: 26
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Description of Protection Function
LIN
HIN
V
V
LO
HO
SD
BS
CC
(1)
(2)
(3)
This product incorporates the under voltage protection circuit to prevent the IGBT from operating in
unsaturated mode when the V
When the V
outputs shut down regardless of the input. This protection function has hysteresis. When the V
(= 11.5 V typ.) reaches 0.5 V higher than the shutdown voltage, this product is automatically restored
and the IGBT is turned on again by the input.
When the V
When the V
on again by the input signal.
This product incorporates the thermal shutdown circuit to protect itself against the abnormal state
when its temperature rises excessively.
When the temperature of this chip rises to the internal setting TSD due to external causes or internal
heat generation , all IGBT outputs shut down regardless of the input. This protection function has
hysteresis ∆TSD (= 50°C typ.). When the chip temperature falls to TSD − ∆TSD, the chip is
automatically restored and the IGBT is turned on again by the input.
Because the chip contains just one temperature detection location, when the chip heats up due to the
IGBT, for example, the differences in distance from the detection location in the IGBT (the source of
the heat) cause differences in the time taken for shutdown to occur. Therefore, the temperature of the
chip may rise higher than the thermal shutdown temperature when the circuit started to operate.
SD pin is the input signal pin to shut down the internal output IGBT. Output of all IGBT is shuted
down after delay times (2µs(typ.)) when "L" signal is inputed to the SD pin from external circuit(MCU
etc.). It is possible to shut down IC when overcurrent and others is detected by external circuit. Shut
down state is released by all of IC input signal "L". At open state of SD pin, shut down function can not
operate.
Under voltage protection
Thermal shutdown
SD pin
BS
CC
BS
UVR (= 9.5 V typ.) reaches 0.5 V higher than the shutdown voltage, the IGBT is turned
power supply falls to this product internal setting V
supply voltage drops V
PRELIMINARY
CC
voltage or the V
BS
UVD (= 9 V typ.), the high-side IGBT output shuts down.
12
BS
voltage drops.
CC
UVD (= 11 V typ.), all IGBT
TPD4123AK
2007-09-13
CC
UVR