SE97TP,147 NXP Semiconductors, SE97TP,147 Datasheet - Page 55

• Manufacturer Part Number: SE97TP,147
• Description: IC TEMP SENSOR DIMM 8-HWSON
• Manufacturer: NXP Semiconductors

Specifications of SE97TP,147

• Function: Temp Monitoring System (Sensor)
• Topology: ADC (Sigma Delta), Comparator, Register Bank
• Sensor Type: Internal
• Sensing Temperature: -40°C ~ 125°C
• Output Type: I²C™/SMBus™
• Output Alarm: Yes
• Output Fan: Yes
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-WSON (Exposed Pad), 8-HWSON
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-4730-2; 935286725147

NXP Semiconductors
18. Contents
1
2
2.1
2.2
2.3
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.3.1
7.3.2
7.3.2.1
7.3.2.2
7.3.3
7.3.3.1
7.3.3.2
7.4
7.4.1
7.5
7.6
7.7
7.8
7.9
7.10
7.10.1
7.10.1.1
7.10.1.2
7.10.1.3
7.10.2
7.10.2.1
7.10.2.2
7.10.2.3
7.10.3
7.10.3.1
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 7
EVENT output condition . . . . . . . . . . . . . . . . . . 8
EVENT pin output voltage levels and
resistor sizing . . . . . . . . . . . . . . . . . . . . . . . . . . 8
EVENT thresholds . . . . . . . . . . . . . . . . . . . . . 10
EVENT operation modes . . . . . . . . . . . . . . . . 11
What temperature is read when
conversion is in progress . . . . . . . . . . . . . . . . 12
SMBus ALERT Response Address
(ARA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Reversible Write Protection (RWP) and
Clear Reversible Write Protection (CRWP) . . 20
Read Reversible Write Protection (RRWP),
and Read Clear Reversible Write Protection
(RCRWP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
General features . . . . . . . . . . . . . . . . . . . . . . . . 2
Temperature sensor features . . . . . . . . . . . . . . 2
Serial EEPROM features . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
Serial bus interface . . . . . . . . . . . . . . . . . . . . . . 7
Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Alarm window . . . . . . . . . . . . . . . . . . . . . . . . . 10
Critical trip. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Comparator mode. . . . . . . . . . . . . . . . . . . . . . 11
Interrupt mode . . . . . . . . . . . . . . . . . . . . . . . . 11
Conversion rate . . . . . . . . . . . . . . . . . . . . . . . 12
Power-up default condition . . . . . . . . . . . . . . . 12
Device initialization . . . . . . . . . . . . . . . . . . . . . 12
SMBus time-out . . . . . . . . . . . . . . . . . . . . . . . 13
SMBus/I
EEPROM operation . . . . . . . . . . . . . . . . . . . . 17
Write operations . . . . . . . . . . . . . . . . . . . . . . . 17
Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Acknowledge polling . . . . . . . . . . . . . . . . . . . . 18
Memory protection . . . . . . . . . . . . . . . . . . . . . 18
Permanent Write Protection (PWP) . . . . . . . . 20
Read Permanent Write Protection (RPWP),
Read operations . . . . . . . . . . . . . . . . . . . . . . . 21
Current address read . . . . . . . . . . . . . . . . . . . 21
2
C-bus interface . . . . . . . . . . . . . . . . 14
DDR memory module temp sensor with integrated SPD, 3.3 V
7.10.3.2
7.10.3.3
7.11
8
8.1
8.2
8.3
8.4
8.5
8.5.1
8.5.2
8.5.3
8.6
8.7
8.8
8.9
9
9.1
9.2
9.3
10
11
12
13
13.1
13.2
13.3
13.4
14
15
16
16.1
16.2
16.3
16.4
17
18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Register descriptions . . . . . . . . . . . . . . . . . . . 23
Application design-in information. . . . . . . . . 35
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 37
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38
Package outline. . . . . . . . . . . . . . . . . . . . . . . . 45
Soldering of SMD packages . . . . . . . . . . . . . . 50
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 52
Revision history . . . . . . . . . . . . . . . . . . . . . . . 53
Legal information . . . . . . . . . . . . . . . . . . . . . . 54
Contact information . . . . . . . . . . . . . . . . . . . . 54
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Selective read . . . . . . . . . . . . . . . . . . . . . . . . 21
Sequential read . . . . . . . . . . . . . . . . . . . . . . . 22
Hot plugging. . . . . . . . . . . . . . . . . . . . . . . . . . 23
Register overview . . . . . . . . . . . . . . . . . . . . . 23
Capability register
(00h, 16-bit read-only) . . . . . . . . . . . . . . . . . . 24
Configuration register
(01h, 16-bit read/write). . . . . . . . . . . . . . . . . . 25
Temperature format . . . . . . . . . . . . . . . . . . . . 29
Temperature Trip Point registers . . . . . . . . . . 30
Upper Boundary Alarm Trip register
(16-bit read/write). . . . . . . . . . . . . . . . . . . . . . 30
Lower Boundary Alarm Trip register
(16-bit read/write). . . . . . . . . . . . . . . . . . . . . . 31
Critical Alarm Trip register
(16-bit read/write). . . . . . . . . . . . . . . . . . . . . . 31
Temperature register
(16-bit read-only) . . . . . . . . . . . . . . . . . . . . . . 32
Manufacturer’s ID register
(16-bit read-only) . . . . . . . . . . . . . . . . . . . . . . 33
Device ID register . . . . . . . . . . . . . . . . . . . . . 33
SMBus register . . . . . . . . . . . . . . . . . . . . . . . 34
SE97 in memory module application . . . . . . . 36
Layout consideration . . . . . . . . . . . . . . . . . . . 36
Thermal considerations . . . . . . . . . . . . . . . . . 36
Introduction to soldering. . . . . . . . . . . . . . . . . 50
Wave and reflow soldering. . . . . . . . . . . . . . . 50
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . 50
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 51
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 54
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Date of release: 29 January 2010
Document identifier: SE97_7
All rights reserved.
SE97