SE97 NXP [NXP Semiconductors], SE97 Datasheet

SE97

Manufacturer Part Number

SE97

Description

DDR memory module temp sensor with integrated SPD, 3.3 V

Manufacturer

NXP [NXP Semiconductors]

Datasheet

1.SE97.pdf (54 pages)

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1. General description

The NXP Semiconductors SE97 measures temperature from 40 C to +125 C with

JEDEC Grade B 1 C accuracy between +75 C and +95 C and also provide 256 bytes

of EEPROM memory communicating via the I

Dual In-line Memory Module (DIMM) measuring the DRAM temperature in accordance

with the new JEDEC (JC-42.4) Mobile Platform Memory Module Temperature Sensor

Component speciﬁcation and also replacing the Serial Presence Detect (SPD) which is

used to store memory module and vendor information.

The SE97 thermal sensor operates over the V

over the range of 3.0 V to 3.6 V write and 1.7 V to 3.6 V read.

Placing the Temp Sensor (TS) on a DIMM allows accurate monitoring of the DIMM module

temperature to better estimate the DRAM case temperature (T

exceeding the maximum operating temperature of 85 C. The chip set throttles the

memory trafﬁc based on the actual temperatures instead of the calculated worst-case

temperature or the ambient temperature using a temp sensor mounted on the

motherboard. There is up to 30 % improvement in thin and light notebooks that are using

one or two 1 GB SO-DIMM modules. The TS is required on DDR3 RDIMM and RDIMM

ECC. Future uses of the TS will include more dynamic control over thermal throttling, the

ability to use the Alarm Window to create multiple temperature zones for dynamic

throttling and to save processor time by scaling the memory refresh rate.

The TS consists of a

own temperature readings 10 times per second, converts the reading to a digital data, and

latches them into the data temperature register. User-programmable registers, the

speciﬁcation of upper/lower alarm and critical temperature trip points, EVENT output

control, and temperature shutdown, provide ﬂexibility for DIMM temperature-sensing

applications.

When the temperature changes beyond the speciﬁed boundary limits, the SE97 outputs

an EVENT signal using an open-drain output that can be pulled up between 0.9 V and

3.6 V. The user has the option of setting the EVENT output signal polarity as either an

active LOW or active HIGH comparator output for thermostat operation, or as a

temperature event interrupt output for microprocessor-based systems. The EVENT output

can even be conﬁgured as a critical temperature output.

The EEPROM is designed speciﬁcally for DRAM DIMMs SPD. The lower 128 bytes

(address 00h to 7Fh) can be Permanent Write Protected (PWP) or Reversible Write

Protected (RWP) by software. This allows DRAM vendor and product information to be

stored and write protected. The upper 128 bytes (address 80h to FFh) are not write

protected and can be used for general purpose data storage.

SE97

DDR memory module temp sensor with integrated SPD, 3.3 V

Rev. 05 — 6 August 2009

Analog-to-Digital Converter (ADC) that monitors and updates its

C-bus/SMBus. It is typically mounted on a

range of 3.0 V to 3.6 V and the EEPROM

case

) to prevent it from

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