SE97 NXP [NXP Semiconductors], SE97 Datasheet - Page 3

• Manufacturer Part Number: SE97
• Description: DDR memory module temp sensor with integrated SPD, 3.3 V
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
3. Applications
4. Ordering information
Table 1.
[1]
[2]
SE97_5
Product data sheet
Type number
SE97PW
SE97TK
SE97TL
SE97TP
SE97TL and SE97TP offer improved V
Industry standard 2 mm
[1]
[1][2]
Ordering information
Topside
mark
SE97
SE97
97L
S97
I
I
I
I
3 mm
DDR2 and DDR3 memory modules
Laptops, personal computers and servers
Enterprise networking
Hard disk drives and other PC peripherals
Package
Name
TSSOP8
HVSON8
HXSON8
HWSON8
0.8 mm package to JEDEC VCED-3 PSON8 in 8 mm
POR
/EVENT I
Description
plastic thin shrink small outline package; 8 leads;
body width 4.4 mm
plastic thermal enhanced very thin small outline package;
no leads; 8 terminals; body 3
plastic thermal enhanced extremely thin small outline package;
no leads; 8 terminals; body 2
plastic thermal enhanced very very thin small outline package;
no leads; 8 terminals; body 2
Rev. 05 — 6 August 2009
OL
DDR memory module temp sensor with integrated SPD, 3.3 V
.
3
3
3
0.85 mm
0.5 mm
0.8 mm
4 mm pitch tape 4 k quantity reels.
© NXP B.V. 2009. All rights reserved.
Version
SOT530-1
SOT908-1
SOT1052-1
SOT1069-1
SE97
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