SE97 NXP [NXP Semiconductors], SE97 Datasheet - Page 5

• Manufacturer Part Number: SE97
• Description: DDR memory module temp sensor with integrated SPD, 3.3 V
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
6. Pinning information
SE97_5
Product data sheet
6.1 Pinning
6.2 Pin description
Table 2.
Symbol
A0
A1
A2
V
SDA
SCL
EVENT
V
Fig 2.
Fig 4.
SS
DD
index area
terminal 1
V
A0
A1
A2
SS
V
Pin configuration for TSSOP8
Pin configuration for HVSON8
A0
A1
A2
SS
1
2
3
4
Pin description
Pin
1
2
3
4
5
6
7
8
1
2
3
4
Transparent top view
SE97PW
Type
I
I
I
ground
I/O
I
O
power
SE97TK
Rev. 05 — 6 August 2009
002aab805
DDR memory module temp sensor with integrated SPD, 3.3 V
002aab803
Description
I
input is overvoltage tolerant to support software write protection.
I
I
device ground
SMBus/I
external pull-up resistor.
SMBus/I
external pull-up resistor.
Thermal alarm output for high/low and critical temperature limit
(open-drain). Must have external pull-up resistor.
device power supply (3.0 V to 3.6 V); supports 1.7 V for
EEPROM read only.
2
2
2
8
7
6
5
C-bus/SMBus slave address bit 0 with internal pull-down. This
C-bus/SMBus slave address bit 1 with internal pull-down
C-bus/SMBus slave address bit 2 with internal pull-down
8
7
6
5
V
EVENT
SCL
SDA
DD
V
EVENT
SCL
SDA
DD
2
2
C-bus serial data input/output (open-drain). Must have
C-bus serial clock input/output (open-drain). Must have
Fig 3.
Fig 5.
terminal 1
index area
terminal 1
index area
V
V
A0
A1
A2
A0
A1
A2
SS
SS
Pin configuration for HXSON8
Pin configuration for HWSON8
1
2
3
4
1
2
3
4
Transparent top view
Transparent top view
SE97TL
SE97TP
© NXP B.V. 2009. All rights reserved.
002aad548
002aad768
SE97
8
7
6
5
8
7
6
5
V
EVENT
SCL
SDA
V
EVENT
SCL
SDA
DD
DD
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