SE95D,118 NXP Semiconductors, SE95D,118 Datasheet - Page 27

• Manufacturer Part Number: SE95D,118
• Description: IC SENSOR TEMP 2.8-5.5V SOT96-1
• Manufacturer: NXP Semiconductors

Specifications of SE95D,118

• Package / Case: 8-SOIC (3.9mm Width)
• Output Type: I²C™
• Function: Temp Sensor, Watchdog
• Topology: ADC (Sigma Delta), Comparator, Register Bank
• Sensor Type: Internal
• Sensing Temperature: -55°C ~ 125°C
• Output Alarm: No
• Output Fan: Yes
• Voltage - Supply: 2.8 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Full Temp Accuracy: +/- 3 C
• Digital Output - Bus Interface: Serial (2-Wire, I2C)
• Digital Output - Number Of Bits: 13 bit
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 55 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935274141118; SE95D-T; SE95D-T

NXP Semiconductors
21. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
7.5
7.6
8
8.1
8.2
8.3
8.4
8.5
8.6
8.7
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
17
18
19
19.1
19.2
19.3
19.4
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
I
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 15
Recommended operating conditions. . . . . . . 15
Static characteristics. . . . . . . . . . . . . . . . . . . . 16
Dynamic characteristics . . . . . . . . . . . . . . . . . 17
Performance curves . . . . . . . . . . . . . . . . . . . . 18
Application information. . . . . . . . . . . . . . . . . . 19
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20
Soldering of SMD packages . . . . . . . . . . . . . . 22
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 25
Legal information. . . . . . . . . . . . . . . . . . . . . . . 26
2
C-bus serial interface . . . . . . . . . . . . . . . . . . . 7
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
General operation . . . . . . . . . . . . . . . . . . . . . . . 4
OS output and polarity . . . . . . . . . . . . . . . . . . . 6
OS comparator and interrupt modes . . . . . . . . 6
OS fault queue . . . . . . . . . . . . . . . . . . . . . . . . . 6
Shutdown mode . . . . . . . . . . . . . . . . . . . . . . . . 7
Power-up default and power-on reset . . . . . . . . 7
Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Register list . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Register pointer . . . . . . . . . . . . . . . . . . . . . . . . 8
Configuration register . . . . . . . . . . . . . . . . . . . . 9
Temperature register. . . . . . . . . . . . . . . . . . . . . 9
Overtemperature shutdown threshold
and hysteresis registers . . . . . . . . . . . . . . . . . 11
Protocols for writing and reading
the registers . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Introduction to soldering . . . . . . . . . . . . . . . . . 22
Wave and reflow soldering . . . . . . . . . . . . . . . 22
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 22
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 23
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 26
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Ultra high accuracy digital temperature sensor and thermal watchdog
20
21
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Contact information . . . . . . . . . . . . . . . . . . . . 26
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Date of release: 2 September 2009
Document identifier: SE95_7
All rights reserved.
SE95