E-L6919ETR STMicroelectronics, E-L6919ETR Datasheet - Page 21

• Manufacturer Part Number: E-L6919ETR
• Description: IC CTRLR 5BIT PROG 2PHASE 28SOIC
• Manufacturer: STMicroelectronics
• Type: Step-Down (Buck)r

Specifications of E-L6919ETR

• Internal Switch(s): No
• Synchronous Rectifier: Yes
• Number Of Outputs: 1
• Voltage - Output: 0.8 ~ 1.55 V
• Current - Output: 2A
• Frequency - Switching: 150kHz
• Voltage - Input: 5 ~ 12 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 28-SOIC (7.5mm Width)
• Power - Output: 2W
• Mounting Style: SMD/SMT
• Operating Supply Voltage: 6.5 V
• Maximum Operating Temperature: 85 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-4592-2

to consider when designing such high current applications.
A good layout solution can generate a benefit in lowering power dissipation on the power paths, reducing radi-
ation and a proper connection between signal and power ground can optimize the performance of the control
loops.
Integrated power drivers reduce components count and interconnections between control functions and drivers,
reducing the board space.
Here below are listed the main points to focus on when starting a new layout and rules are suggested for a cor-
rect implementation.
These are the connections where switching and continuous current flows from the input supply towards the load.
The first priority when placing components has to be reserved to this power section, minimizing the length of
each connection as much as possible.
To minimize noise and voltage spikes (EMI and losses) these interconnections must be a part of a power plane
and anyway realized by wide and thick copper traces. The critical components, i.e. the power transistors, must
be located as close as possible, together and to the controller.
Considering that the "electrical" components reported in figure are composed by more than one "physical" com-
ponent, a ground plane or "star" grounding connection is suggested to minimize effects due to multiple connec-
tions.
Figure 16. Power connections and related connections layout guidelines (same for both phases)
Fig. 16a shows the details of the power connections involved and the current loops. The input capacitance (C
Power Connections.
SGND
LGATEx
HGATEx
PHASEx
PGNDx
PHASEx
BOOTx
VCC
b. PCB small signal components placement
a. PCB power and ground planes areas
C
BOOTx
+V
R
R
CC
gate
gate
C
VCC
HS
LS
HS
LS
D
D
V
C
V
C
IN
IN
IN
IN
L
L
C
C
OUT
OUT
LOAD
LOAD
L6919E
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IN
),