TLP701(TP,F) Toshiba, TLP701(TP,F) Datasheet - Page 2
![IC PHOTOCOUPLER IRED 6SMD](/photos/7/66/76655/tlp701_tp_f__sml.jpg)
TLP701(TP,F)
Manufacturer Part Number
TLP701(TP,F)
Description
IC PHOTOCOUPLER IRED 6SMD
Manufacturer
Toshiba
Specifications of TLP701(TP,F)
Voltage - Isolation
5000Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
600mA
Current - Dc Forward (if)
20mA
Input Type
DC
Output Type
Push-Pull, Totem-Pole
Mounting Type
Surface Mount
Package / Case
6-SMD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
TLP701FTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TLP701(TP,F)
Manufacturer:
TOSHIBA
Quantity:
30 000
Company:
Part Number:
TLP701(TP,F)
Manufacturer:
HYNIX
Quantity:
178
Company:
Part Number:
TLP701(TP,F)
Manufacturer:
TOSHIBA
Quantity:
2 317
Part Number:
TLP701(TP,F)
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
Part Number:
TLP701(TP,F)/CTS701(T1)
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
As a type of isolator favored by manufacturers, photocouplers
now serve as noise protectors in many electronic devices.
Toshiba’s photocouplers consist of either a GaAs or GaA As
infrared LED(s) and a silicon photodetector(s) housed in a mold
package. GaA As LEDs are adopted in high-speed photo-IC
types due to their high-speed and high-light output.
C O N T E N T S
1. Product Index ............................................................... 3
2. New Products .............................................................. 5
3. Photocoupler Product Tree .......................................... 9
4. Selection Guide ......................................................... 10
5. Part Naming Conventions .......................................... 41
Preface
1
2. Photocouplers for Logic Signal Transmission
3. Photocouplers for IGBT/MOSFET Gate Drive
4. Photorelays (1-Form-A and 2-Form-A)
5. Photorelays
6. Triac-Output Photocouplers
7. Thyristor-Output Photocouplers
8. Photovoltaic-Output photocouplers
9. Products Manufactured by Toshiba Semiconductor
.
(1-Form-B, 2-Form-B and 1-Form-A/1-Form-B)
Transistor-Output and Darlington-Transistor-
Output Photocouplers
(Thailand) Co., Ltd. (TST)
Perspective view
of the TLP521-1
............................................... 10
......................................... 38
...................................... 34
of the TLP521-1
Cross section
................................ 37
.......................... 38
.................... 26
.......... 17
........ 23
...... 32
White overmold
(epoxy)
Detector
Dome (silicon)
Infrared LED
Lead frame
6. Package Information .................................................. 42
7. Packing Information ................................................... 50
8. Board Assembly ......................................................... 56
9. Device Degradation ................................................... 58
10. Safety Standard Approvals ...................................... 65
11. Photocoupler Application Circuit Examples ............. 67
12. Competitor Cross Reference ................................... 79
1
2
3
1
2
1
2
1
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.
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.
.
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Lead Form Options for DIP Packages
Package Dimensions
Rank Marking .........................................................
Photocoupler Magazine Packing
Tape-and-Reel Specifications
Example Land Patterns ..........................................
Board Assembly Considerations
Projected Operating Life Based on LED Light
Specifications
Output Degradation
2
To meet customers’ various needs, we offer an extensive
product portfolio shown below as well as general-
purpose photocouplers.
UL approval has been obtained under file number E67349 for
most of our photocouplers. EN60747-5-2-approved
photocouplers are also offered with a wide selection of output
(transistor, thyristor, triac, IC output and photorelay). The
designs of these devices meet other standards including
IEC380/VDE0806, IEC60950/EN60950 and IEC60065/EN60065.
Toshiba offers a wide variety of photocouplers in a small
package to meet the space-saving requirement of increasingly
smaller and thinner end products. Packaging options include
mini-flat packages (MFSOPs) and half-pitch (1.27 mm) mini-flat
SOP packages.
Part of the general-purpose photocouplers with transistor and
triac outputs are manufactured by Toshiba Semiconductor
Thailand Co., Ltd. This will help customers procure components
locally for overseas assembly of end products.
Extensive Line of Products
Safety Standard Approvals
Small-Package Products
Overseas Manufactured Photocouplers
1. Photo-IC couplers: High speed and advanced functions
2. Zero-crossing phototriac couplers: Phototriac-output
3. Photovoltaic couplers: MOSFET gate drive (high voltage
4. Photorelays (MOSFET-output devices):
(highly integrated detectors)
devices with zero-crossing detection
output achieved using a photodiode array)
............................................................. 51
AC-DC switches (MOSFET output)
Mechanical relay replacement
................................................... 58
................................................. 43
................................... 53
.............................. 57
..................... 42
49
56