HCNR201-300E Avago Technologies US Inc., HCNR201-300E Datasheet - Page 5

• Manufacturer Part Number: HCNR201-300E
• Description: OPTOCOUPLER ANLG DC-1MHZ GW 8SMD
• Manufacturer: Avago Technologies US Inc.

Specifications of HCNR201-300E

• Output Type: Linear Photovoltaic
• Input Type: DC
• Package / Case: 8-SMD Gull Wing
• Number Of Channels: 1
• Voltage - Isolation: 5000Vrms
• Current Transfer Ratio (min): 0.36% @ 10mA
• Current Transfer Ratio (max): 0.72% @ 10mA
• Current - Dc Forward (if): 25mA
• Mounting Type: Surface Mount, Gull Wing
• Current Transfer Ratio: 0.36 % to 0.72 %
• Forward Current: 1 mA to 20 mA
• Isolation Voltage: 5000 Vrms
• Minimum Forward Diode Voltage: 1.2 V
• Output Device: Photodiode
• Configuration: 1 Channel
• Maximum Forward Diode Voltage: 1.95 V
• Maximum Reverse Diode Voltage: 2.5 V
• Maximum Input Diode Current: 25 mA
• Maximum Power Dissipation: 60 mW
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 55 C
• No. Of Channels: 1
• Optocoupler Output Type: Photodiode
• Input Current: 20mA
• Output Voltage: 15V
• Opto Case Style: SMD
• No. Of Pins: 8
• Forward Voltage: 1.6V
• Rohs Compliant: Yes
• Forward Current If: 25mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Output: -
• Current - Output / Channel: -
• Vce Saturation (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 516-1609-5

Solder Reflow Temperature Profile
Recommended Pb-Free IR Profile
Regulatory Information
The HCNR200/201 optocoupler features a 0.400” wide, eight pin DIP package. This package was specifically designed
to meet worldwide regulatory requirements. The HCNR200/201 has been approved by the following organizations:
UL
Recognized under UL 1577, Component Recognition
Program, FILE E55361
CSA
Approved under CSA Component Acceptance Notice
#5, File CA 88324
5
TEMPERATURE
ROOM
T
T
smax
smin
25
T
T
300
200
100
p
L
0
0
217 °C
NOTE: NON-HALIDE FLUX SHOULD BE USED.
150 - 200 °C
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
160 °C
150 °C
140 °C
t 25 °C to PEAK
60 to 180 SEC.
PREHEAT
3 °C/SEC. MAX.
t
s
RAMP-UP
50
* 245 +0/-5 °C
3 °C + 1 °C/–0.5 °C
TIME
150 °C, 90 + 30 SEC.
PREHEATING TIME
t
t
L
p
2.5 C ± 0.5 °C/SEC.
100
TIME (SECONDS)
15 SEC.
60 to 150 SEC.
TIME WITHIN 5 °C of ACTUAL PEAK TEMPERATURE
RAMP-DOWN
6 °C/SEC. MAX.
245 °C
TEMP.
PEAK
IEC/EN/DIN EN 60747-5-2
Approved under
IEC 60747‑5‑2:1997 + A1:2002
EN 60747‑5‑2:2001 + A1:2002
DIN EN 60747‑5‑2 (VDE 0884 Teil 2):2003‑01
(Option 050 only)
150
SEC.
30
SEC.
30
NOTES:
THE TIME FROM 25 °C to PEAK
TEMPERATURE = 8 MINUTES MAX.
T
NOTE: NON-HALIDE FLUX SHOULD BE USED.
smax
= 200 °C, T
50 SEC.
SOLDERING
200 °C
TIME
200
smin
PEAK
TEMP.
240 °C
= 150 °C
TIGHT
TYPICAL
LOOSE
230 °C
TEMP.
PEAK
250