TLP114A(TPR,F) Toshiba, TLP114A(TPR,F) Datasheet - Page 65

TRANSCOUPLER HS TRANS OUT 5-MSOP

TLP114A(TPR,F)

Manufacturer Part Number
TLP114A(TPR,F)
Description
TRANSCOUPLER HS TRANS OUT 5-MSOP
Manufacturer
Toshiba
Datasheets

Specifications of TLP114A(TPR,F)

Number Of Channels
1
Input Type
DC
Voltage - Isolation
3750Vrms
Current Transfer Ratio (min)
20% @ 16mA
Voltage - Output
20V
Current - Output / Channel
8mA
Current - Dc Forward (if)
20mA
Output Type
Transistor with Vcc
Mounting Type
Surface Mount
Package / Case
5-MSOP
Output Device
Transistor With Base
Number Of Elements
1
Reverse Breakdown Voltage
5V
Forward Current
20mA
Package Type
MFSOP
Collector Current (dc) (max)
8mA
Isolation Voltage
3750Vrms
Power Dissipation
100mW
Pin Count
5
Mounting
Surface Mount
Operating Temp Range
-55C to 100C
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Vce Saturation (max)
-
Current Transfer Ratio (max)
-
Lead Free Status / Rohs Status
Compliant
10
Toshiba offers a wide selection of photocouplers with a transistor output, IC output, thyristor output and triac output, as well as photore-
lays certified to UL (USA), cUL (Canada), VDE (Germany), BSI (Britain) and SEMKO (Sweden).
Safety Standard Approvals for Photocouplers
The table above lists photocouplers and photorelays that have already been approved as of January 2011. The information herein is subject to change. For the latest
information, please contact your nearest Toshiba sales representative.
Construction
Mechanical
60747-5-2
VDE/TÜV
Certified
Devices
Ratings
(min)
Mechanical Construction
DIN
EN
Construction
Package
Internal
Isolation Clearance
Isolation Thickness
Isolation Creepage
Working Insulation
Internal Creepage
Transistor Output
Highest Allowable
Safety Standard Approvals
Voltage (Viorm)
Triac/Thyrsitor
Overvoltage
Photorelay
Path (mm)
IC Output
Path (mm)
(Viotm)
Output
(mm)
(mm)
Max.
TLP280
TLP280-4
TLP281
TLP281-4
4000 Vpk
565 Vpk
4.0
4.0
0.4
SOP4/SOP16
LED Chip
Reflective Photocouplers in
Single-Molded Packages
Coupling Medium
TLP284
TLP284-4
TLP285
TLP285-4
(Window)
6000 Vpk
707 Vpk
5.0
5.0
0.4
Photo Detector Chip
TLP180
TLP181
TLP260J
TLP261J
Package
(Body)
6000 Vpk
MFSOP6
565 Vpk
4.0
4.0
0.4
Lead
65
TLP127
TLP160G
TLP160J
TLP161G
TLP161J
(DIN EN60747-5-2)
MFSOP6
4000 Vpk
565 Vpk
4.0
4.0
Photo Detector Chip
Transmissive Photocouplers in Single-Molded Packages
TLP2105
TLP2108
TLP2166A
TLP2116
TLP2117
4000 Vpk
565 Vpk
(2 ch)
SO8
4.2
4.2
TLP176A
TLP176D
TLP176G
TLP197G
TLP206G
LED Chip
2500 Vpk
2.54SOP
565 Vpk
4/6/8
4.0
4.0
Coupling Medium
(Window)
TLP350
TLP351
TLP560G
TLP560J
TLP561G
TLP561J
TLP227G
TLP227G-2
TLP597G
4000 Vpk
/890 Vpk
630 Vpk
6.4/7.0
6.4/7.0
(0.4)
DIP
Package
(Body)
Lead
TLP350F
TLP351F
1140 Vpk
6000 Vpk
(F type)
(0.4)
DIP
8.0
8.0

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