TLP624 Toshiba, TLP624 Datasheet - Page 2
![PHOTOCOUPLER TRANS-OUT 4-DIP](/photos/7/69/76960/264-4-dip_sml.jpg)
TLP624
Manufacturer Part Number
TLP624
Description
PHOTOCOUPLER TRANS-OUT 4-DIP
Manufacturer
Toshiba
Specifications of TLP624
Number Of Channels
1
Input Type
DC
Voltage - Isolation
5000Vrms
Current Transfer Ratio (min)
100% @ 1mA
Current Transfer Ratio (max)
1200% @ 1mA
Voltage - Output
55V
Current - Output / Channel
50mA
Current - Dc Forward (if)
60mA
Vce Saturation (max)
400mV
Output Type
Transistor
Mounting Type
Through Hole
Package / Case
4-DIP (0.300", 7.62mm)
No. Of Channels
1
Isolation Voltage
5kV
Optocoupler Output Type
Phototransistor
Input Current
16mA
Output Voltage
55V
Opto Case Style
DIP
No. Of Pins
4
Approval Bodies
UL
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
TLP624BV
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TLP624
Manufacturer:
TOSJ
Quantity:
1 400
Part Number:
TLP624
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
Part Number:
TLP624(BV
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
Part Number:
TLP624(BV,F)
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
Company:
Part Number:
TLP624(F)
Manufacturer:
FAIRCHILD
Quantity:
1 000
Part Number:
TLP624(F)
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
Company:
Part Number:
TLP624-1
Manufacturer:
TOSJ
Quantity:
5 510
Company:
Part Number:
TLP624-1
Manufacturer:
PULSE
Quantity:
5 510
Part Number:
TLP624-1
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
Absolute Maximum Ratings
Recommended Operating Conditions
Storage temperature range
Operating temperature range
Lead soldering temperature
Total package power dissipation(1 Circuit)
Total package power dissipation derating
(Ta ≥ 25°C, 1 Circuit)
Isolation voltage
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
(Note 1) Device considered a two terminal device: LED side pins shorted together, and detector side pins shorted
Supply voltage
Forward current
Collector current
Operating temperature
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
Forward current
Forward current detating
Pulse forward current
Power dissipation(1 Circuit)
Power dissipation derating
Reverse voltage
Junction temperature
Collector−emitter voltage
Emitter−collector voltage
Collector current
Collector power dissipation(1 circuit)
Collector power dissipation derating
(Ta ≥ 25°C, 1 Circuit)
Junction temperature
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
together.
Characteristic
(Ta ≥ 25°C, 1 Circuit)
Characteristic
(Ta = 25°C)
Symbol
V
T
I
I
CC
opr
C
F
Min.
−25
―
―
―
(Note 1)
2
Typ.
1.6
―
5
1
ΔP
ΔP
ΔP
ΔI
Symbol
Max.
V
V
P
BV
T
T
24
20
10
75
F
I
C
P
V
P
D
CEO
ECO
P
T
FP
I
I
T
T
stg
opr
sol
C
F
/ °C
D
R
C
T
j
/
j
/ °C
/ °C
S
TLP624,TLP624−2,TLP624−4
°C
−0.7(Ta ≥ 39°C) −0.5(Ta ≥ 25°C) mA / °C
Unit
mA
mA
°C
V
5000(AC, 1min., RH≤60%)
TLP624
1(100μs, pulse, 100pps)
−1.0
−1.5
−2.5
100
150
250
60
−55~125
−55~100
260(10s)
Rating
125
125
55
50
5
7
TLP624−2
TLP624−4
−0.7
−1.0
−1.5
100
150
50
70
2007-10-01
mW / °C
mW / °C
mW / °C
Vrms
Unit
mW
mW
mW
mA
mA
°C
°C
°C
°C
°C
A
V
V
V