TLP112(TPR,F) Toshiba, TLP112(TPR,F) Datasheet - Page 9
![TRANSCOUPLER HS TRANS OUT 5-MSOP](/photos/7/66/76686/264-5-mfsop_black_sml.jpg)
TLP112(TPR,F)
Manufacturer Part Number
TLP112(TPR,F)
Description
TRANSCOUPLER HS TRANS OUT 5-MSOP
Manufacturer
Toshiba
Specifications of TLP112(TPR,F)
Number Of Channels
1
Input Type
DC
Voltage - Isolation
2500Vrms
Current Transfer Ratio (min)
10% @ 16mA
Voltage - Output
15V
Current - Output / Channel
8mA
Current - Dc Forward (if)
25mA
Output Type
Transistor with Vcc
Mounting Type
Surface Mount
Package / Case
5-MSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Vce Saturation (max)
-
Current Transfer Ratio (max)
-
Other names
TLP112FTR
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Photocoupler Product Tree
3
DIP8
Package
Photocoupler Product Tree
DIP4
Photorelays
Photorelays
2.54SOP4
Triac Output
Thyristor- and Triac-Output
DIP16
SOP4
SO8
2.54SOP6
ZC
DIP6
Transistor-Output
Thyristor Output
SDIP6
SO6
SO16
SOP16
MFSOP6
2.54SOP8
SSOP4
USOP4
Transistor-Output
Output Choices
2.54SOP4
2.54SOP8
MFSOP6
SSOP4
USOP4
SOP16
SDIP6
SOP4
SO16
DIP4
DIP8
SO6
SO8
9
Darlington-Transistor Output
Photovoltaic-Output
Photovoltaic-Output
●
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●
●
●
●
●
●
●
●
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2.54SOP6
≥ 7-mm clearance/creepage; ≥ 0.4-mm isolation thickness
6-pin SMD package (1.27-mm lead pitch)
≥ 5-mm clearance/creepage; ≥ 0.4-mm isolation thickness
5-pin SMD package (1.27-mm lead pitch); low-profile
8-pin SMD package (1.27-mm lead pitch)
16-pin SMD package (1.27-mm lead pitch)
4-pin SMD package (1.27-mm lead pitch)
16-pin SMD package (1.27-mm lead pitch)
SMD package (1.27-mm lead pitch)
SMD package (2.54-mm lead pitch)
Ultra-small; SMD package (1.27-mm lead pitch)
Ultra-small; SMD package (1.27-mm lead pitch)
DIP16
DIP6
●
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General-purpose packages
Lead-forming options for surface mounting
Logic Output
Gate Drive
IC-Output
GND
GND
Vcc
V
CC
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