TLP3042SCFT Toshiba, TLP3042SCFT Datasheet - Page 22
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TLP3042SCFT
Manufacturer Part Number
TLP3042SCFT
Description
PHOTOCOUPLER ZC TRIAC OUT 6-DIP
Manufacturer
Toshiba
Specifications of TLP3042SCFT
Voltage - Isolation
5000Vrms
Number Of Channels
1
Voltage - Off State
400V
Output Type
AC, Triac, Zero Cross
Current - Gate Trigger (igt) (max)
10mA
Current - Hold (ih)
600µA
Current - Dc Forward (if)
20mA
Current - Output / Channel
100mA
Mounting Type
Through Hole
Package / Case
6-DIP
Output Device
PhotoTriac
Isolation Voltage
5000 V
Peak Output Voltage (vdrm)
400 V
Maximum Input Voltage
120 VAC
Maximum Output Voltage
400 V
Minimum Trigger Current
5 mA
Configuration
1 Channel
Maximum Continuous Output Current
100 mA
Maximum Input Current
25 mA
Maximum Operating Temperature
+ 100 C
Maximum Power Dissipation
330 mW
Maximum Reverse Diode Voltage
5 V
Minimum Operating Temperature
- 40 C
Mounting Style
Through Hole
Zero-crossing Circuit
Yes
Number Of Elements
1
Forward Voltage
1.3V
Repetitive Peak Off-state Volt
400V
Operating Temp Range
-25C to 85C
Output Current
100mA
Package Type
PDIP
Reverse Breakdown Voltage
5V
Mounting
Through Hole
Pin Count
5
Trigger Current
5mA
Zero Crossing Circuit
Yes
Operating Temperature Classification
Commercial
Forward Current
50mA
Power Dissipation
330mW
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
TLP3042(S,C,F)
TLP3042(S,C,F,T)
TLP3042SF
TLP3042(S,C,F,T)
TLP3042SF
4
Photocouplers for Logic Signal Transmission at 1 Mbit/s (Typ.) (Continued)
IPM-Drive Photocouplers
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
TLP759
TLP759F
TLP2530
TLP2531
TLP104
TLP2404
TLP714
TLP714F
TLP754*
TLP754F*
TLP109 ( IGM )
TLP2409 ( IGM )
TLP750
TLP750F
TLP751
TLP751F
Part Number
Part Number
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
TÜV and VDE: : Approved
For the latest information, please contact your nearest Toshiba sales representative.
Selection Guide
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
EN 60747-5-2-approved with option V4 or D4
Pin Configuration
8
1
Pin Configuration
8
1
8
1
8
1
8
1
8
1
8
1
8
1
6
1
6
1
6
1
7
2
7
2
7
2
7
2
7
2
7
2
7
2
7
2
5
5
5
6
3
6
3
6
3
6
3
6
3
6
3
6
3
6
3
: Design which meets safety standard/approval pending as of January 2011
5
4
5
4
4
3
4
3
4
3
5
4
5
4
5
4
5
4
5
4
5
4
DIP8
IEC60950-compliant
version of the TLP559
SEMKO-approved
DIP8
Dual-channel version of
the 6N135 and the TLP550
DIP8
Dual-channel version of
the 6N136 and the TLP550
DIP8
High CMR
SEMKO-approved
DIP8
Internal base connection
SEMKO-approved
SO6 (reinforced insulation)
IPM drive
High CMR
SO8
IPM drive
High CMR
SO6 (reinforced insulation)
IPM drive
T
SDIP6 (reinforced insulation)
IPM drive
T
High isolation voltage
SO8
IPM drive
T
SO8 version of the TLP104
DIP8
IPM drive
opr
opr
opr
= 125°C (max)
= 125°C (max)
= 125°C (max)
Features
Features
: Approved (reinforced insulation)
(NRZ) (Typ.)
Propagation
Delay Time
Data Rate
1 Mbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
550 ns
550 ns
800 ns
800 ns
550 ns
550 ns
(Max)
22
Output Form/CTR
(19% min for rank 0)
Open-collector
Open-collector
Open-collector
Open-collector
(Inverter logic)
(Inverter logic)
20%
19%
25% (min)
20%
10%
10%
7%
CTR
: Design which meets safety standard/approval pending as of January 2011
(min)
(min)
(min)
(min)
(min)
(min)
16 mA
16 mA
16 mA
10 mA
10 mA
16 mA
16 mA
(Max)
5 mA
5 mA
5 mA
5 mA
@I
I
I
FHL
FLH
F
,
Vrms
Vrms
Vrms
5000
2500
2500
3750
Vrms
3750
Vrms
5000
Vrms
5000
Vrms
3750
Vrms
3750
Vrms
Vrms
Vrms
5000
5000
BVs
BVs
UL/cUL TÜV
UL/cUL TÜV
/
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Safety Standards
Safety Standards
VDE
VDE
(1)
(1)
(1)
(1)
BSI
BSI
(2)
(2)
IEC
IEC