MT4LSDT864HG-13EG2 Micron Technology Inc, MT4LSDT864HG-13EG2 Datasheet - Page 13
![MODULE SDRAM 64MB 144SODIMM](/photos/7/83/78349/mfg_mt_sodimm_series_sml.jpg)
MT4LSDT864HG-13EG2
Manufacturer Part Number
MT4LSDT864HG-13EG2
Description
MODULE SDRAM 64MB 144SODIMM
Manufacturer
Micron Technology Inc
Datasheet
1.MT4LSDT864HY-133G2.pdf
(22 pages)
Specifications of MT4LSDT864HG-13EG2
Memory Type
SDRAM
Memory Size
64MB
Speed
133MHz
Package / Case
144-SODIMM
Main Category
DRAM Module
Sub-category
SDRAM
Module Type
144SODIMM
Device Core Size
64b
Organization
8Mx64
Total Density
64MByte
Chip Density
128Mb
Access Time (max)
5.4ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
3.3V
Operating Current
660mA
Number Of Elements
4
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Operating Temp Range
0C to 65C
Operating Temperature Classification
Commercial
Pin Count
144
Mounting
Socket
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Table 11: I
Notes: 1, 5, 6, 11, 13; notes appear on page 16; V
Table 12: I
Notes: 1, 5, 6, 11, 13; notes appear on page 16; V
09005aef80748a77
SD4C4_8_16X64HG.fm - Rev. C 6/04 EN
PARAMETER/CONDITION
OPERATING CURRENT: Active Mode; Burst = 2; READ or
WRITE;
STANDBY CURRENT: Power-Down Mode; All device device
banks idle; CKE = LOW
STANDBY CURRENT: Active Mode;
CKE = HIGH; CS# = HIGH; All device banks active after
met; No accesses in progress
OPERATING CURRENT: Burst Mode; Continuous burst; READ
or WRITE; All device banks active
AUTO REFRESH CURRENT
CKE = HIGH; S# = HIGH
SELF REFRESH CURRENT: CKE
(Low power not available with industrial
temperature option)
PARAMETER/CONDITION
OPERATING CURRENT: Active Mode; Burst = 2; READ or
WRITE;
STANDBY CURRENT: Power-Down Mode; All device device
banks idle; CKE = LOW
STANDBY CURRENT: Active Mode;
CKE = HIGH; CS# = HIGH; All device banks active after
met; No accesses in progress
OPERATING CURRENT: Burst Mode; Continuous burst; READ
or WRITE; All device banks active
AUTO REFRESH CURRENT
CKE = HIGH; S# = HIGH
SELF REFRESH CURRENT: CKE
(Low power not available with industrial
temperature option)
t
t
RC =
RC =
t
t
RC (MIN)
RC (MIN)
DD
DD
Specifications and Conditions – 64MB
Specifications and Conditions – 128MB
0.2V
0.2V
t
t
t
t
RFC =
RFC = 15.625µs
RFC =
RFC = 7.8125µs
Low Power (L)
Low Power (L)
Standard
Standard
DD
DD
t
t
RFC (MIN)
RFC (MIN)
, V
, V
DD
DD
t
t
RCD
RCD
Q = +3.3V ±0.3V
Q = +3.3V ±0.3V
13
SYMBOL
SYMBOL
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
1
2
3
4
5
6
7
7
1
2
3
4
5
6
7
7
32MB, 64MB, 128MB (x64, SR)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1,320
1,140
-13E
-13E
640
200
660
540
160
540
12
14
10
8
8
4
8
6
144-PIN SDRAM SODIMM
MAX
MAX
1,240 1,080
1,080 1,080
-133
-133
600
200
600
500
160
540
12
14
10
8
8
4
8
6
-10E
-10E
560
160
560
500
160
540
12
14
10
8
8
4
8
6
©2004 Micron Technology, Inc. All rights reserved.
UNITS
UNITS
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
3, 18, 19, 29
3, 12, 19, 29
3, 18, 19, 29
3, 18, 19, 29
3, 12, 19, 29
3, 18, 19, 29
19, 29, 30
19, 29, 30
3, 12, 18,
3, 12, 18,
NOTES
NOTES
29
29
4
4