MT16LSDF6464HY-133D2 Micron Technology Inc, MT16LSDF6464HY-133D2 Datasheet - Page 14
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MT16LSDF6464HY-133D2
Manufacturer Part Number
MT16LSDF6464HY-133D2
Description
MODULE SDRAM 512MB 144-SODIMM
Manufacturer
Micron Technology Inc
Datasheet
1.MT16LSDF6464HY-13ED2.pdf
(22 pages)
Specifications of MT16LSDF6464HY-133D2
Memory Type
SDRAM
Memory Size
512MB
Speed
133MHz
Package / Case
144-SODIMM
Main Category
DRAM Module
Sub-category
SDRAM
Module Type
144SODIMM
Device Core Size
64b
Organization
64Mx64
Total Density
512MByte
Chip Density
256Mb
Access Time (max)
6/5.4ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
3.3V
Operating Current
1.096A
Number Of Elements
16
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Operating Temp Range
0C to 65C
Operating Temperature Classification
Commercial
Pin Count
144
Mounting
Socket
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT16LSDF6464HY-133D2
Manufacturer:
MICRON
Quantity:
1 575
Company:
Part Number:
MT16LSDF6464HY-133D2 PCB
Manufacturer:
SIEMENS
Quantity:
201
Table 14: Electrical Characteristics and Recommended AC Operating Conditions
Notes: 5, 6, 8, 9, 11, 31; notes appear on page 16; comply with PC100 and PC133 specifications, based on SDRAM device
pdf: 09005aef807924d2, source: 09005aef807924f1
SDF16C32_64x64HG.fm - Rev. E 4/06 EN
AC CHARACTERISTICS
PARAMETER
Access time from
CLK (positive edge)
Address hold time
Address setup time
CLK high-level width
CLK low-level width
Clock cycle time
CKE hold time
CKE setup time
CS#, RAS#, CAS#, WE#, DQM hold
time
CS#, RAS#, CAS#, WE#, DQM setup
time
Data-in hold time
Data-in setup time
Data-out High-Z time
Data-out Low-Z time
Data-out hold time (load)
Data-out hold time (no load)
ACTIVE-to-PRECHARGE command
ACTIVE-to-ACTIVE command period
ACTIVE-to-READ or WRITE delay
Refresh period
AUTO REFRESH period
PRECHARGE command period
ACTIVE bank a to ACTIVE bank b
command
Transition time
WRITE recovery time
Exit SELF REFRESH to ACTIVE
command
CL = 3
CL = 2
CL = 3
CL = 2
CL = 3
CL = 2
SYMBOL
t
t
t
t
t
t
t
t
t
AC(3)
AC(2)
t
t
t
CK(3)
CK(2)
t
HZ(3)
HZ(2)
t
t
CMH
t
t
OHN
t
t
CMS
t
t
t
CKH
RCD
RRD
t
CKS
t
RAS
t
t
XSR
t
t
REF
RFC
OH
WR
AH
DH
CH
AS
CL
DS
RC
RP
t
LZ
T
1 CLK
+ 7ns
MIN
0.8
1.5
2.5
2.5
7.5
0.8
1.5
0.8
1.5
0.8
1.5
1.8
0.3
37
60
15
66
15
14
14
67
7
1
3
-13E
120,000
14
MAX
5.4
5.4
5.4
5.4
1.2
64
1 CLK +
7.5ns
MIN
Micron Technology, Inc., reserves the right to change products or specifications without notice.
0.8
1.5
2.5
2.5
7.5
0.8
1.5
0.8
1.5
0.8
1.5
1.8
0.3
10
44
66
20
66
20
15
15
75
1
3
-133
144-PIN SDRAM SODIMM
120,000
256MB, 512MB (x64, DR)
MAX
5.4
5.4
1.2
64
6
6
1 CLK
+ 7ns
MIN
1.8
0.3
10
50
70
20
70
20
20
15
80
1
2
3
3
8
1
2
1
2
1
2
1
3
-10E
120,000
©2006 Micron Technology, Inc. All rights reserved.
MAX
1.2
64
6
6
6
6
UNITS
ms
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
NOTES
27
23
23
10
10
28
32
24
25
20
7