DEMOBOARD TLE 6288R Infineon Technologies, DEMOBOARD TLE 6288R Datasheet - Page 27

BOARD DEMO FOR TLE 6288R

DEMOBOARD TLE 6288R

Manufacturer Part Number
DEMOBOARD TLE 6288R
Description
BOARD DEMO FOR TLE 6288R
Manufacturer
Infineon Technologies
Datasheet

Specifications of DEMOBOARD TLE 6288R

Main Purpose
Power Management, High & Low Side Driver (Internal FET)
Embedded
No
Utilized Ic / Part
TLE6288
Primary Attributes
3 Channel High Side, 3 Channel High/Low Side Configurable
Secondary Attributes
SPI Interface
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
DEMOBOARDTLE6288RIN
7
7.1
Figure 18
7.2
All thermal resistance values in this document are data from FEM (Finite Element Modelling). The boundary
conditions are chosen according to the JESD51 standard. Therefore, all values can be viewed as reliable and
reproducible.
The high effective thermal conductivity test PCB (2s2p) gives a near best case thermal performance value.
compared to the single layer low effective thermal conductivity PCB (1s). It should be emphasized that values
measured/simulated with these test boards cannot be used to directly predict any particular system application
performance.
In real applications, the
specific multi layer PCBs and a direct thermal connection to the ECU metal-case are often used to improve the
thermal impedance
Data Sheet
Conditions for
– Results based on FEM Simulations
T
Single Channel operation, 0.8W power dissipation
case
= 125 °C
Application Information
Z
Z
Thermal Application Information
thjc
thjc
0,01
0,1
0,000001
10
Figure 18
Diagram Junction - Case for Single channel operation
Diagram
1
R
thjA
R
.
thjA
can be influenced by the environment and PCB conditions. Thermal vias, application
0,00001
0,0001
Pulse width [s]
27
0,001
0,01
Dutycycle D
0,5
0,2
0,1
0,05
0,02
0,01
Application Information
Rev. 2.4, 2007-08-08
0,1
TLE6288R

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