ADIS16365/PCBZ Analog Devices Inc, ADIS16365/PCBZ Datasheet - Page 2

• Manufacturer Part Number: ADIS16365/PCBZ
• Description: BOARD INTERFACE FOR ADIS16365
• Manufacturer: Analog Devices Inc
• Series: iMEMS®, iSensor™r

Specifications of ADIS16365/PCBZ

• Sensor Type: Accelerometer, Gyroscope, 3 Axis
• Sensing Range: ±17g, ±75°/sec, ±150°/sec, ±300°/sec
• Interface: SPI Serial
• Sensitivity: 3.3mg/LSB, 0.0125 ~ 0.05°/sec/LSB
• Voltage - Supply: 4.75 V ~ 5.25 V
• Embedded: No
• Utilized Ic / Part: ADIS16365
• Silicon Manufacturer: Analog Devices
• Application Sub Type: Accelerometer / Gyroscope
• Kit Application Type: Sensing - Motion / Vibration / Shock
• Silicon Core Number: ADIS16365
• Lead Free Status / RoHS Status: Not applicable / RoHS Compliant
• For Use With: ADISUSBZ - KIT EVAL ADIS W/SOFTWARE USB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Not applicable / RoHS Compliant

ADIS16360/ADIS16365
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 6
Pin Configuration and Function Descriptions............................. 7
Typical Performance Characteristics ............................................. 8
Theory of Operation ........................................................................ 9
REVISION HISTORY
2/11—Rev. C to Rev. D
Changes to Gyroscopes Misalignment and Accelerometers
Misalignment Test Conditions/Comments, Table 1 .................... 3
Changes to Table 30 and Table 31 ................................................ 16
8/10—Rev. B to Rev. C
Changes to Figure 11........................................................................ 9
Changes to Table 8.......................................................................... 10
Changes to Burst Read Data Collection Section ........................ 11
Changes to Internal Sample Rate Section.................................... 12
Changes to Product Identification Section and Table 32 .......... 16
12/09—Rev. A to Rev. B
Reorganized Layout............................................................Universal
Changes to Features Section............................................................ 1
Changes to Table 1............................................................................ 3
Changes to Table 2............................................................................ 5
Changes to Table 5............................................................................ 7
Changes to Table 7 and Device Configuration Section............... 9
Changes to Table 8.......................................................................... 10
Changes to Burst Read Data Collection Section, Output
Data Registers Section, and Table 9 ............................................. 11
Added Table 10, Table 11, Table 12, Table 13, and Table 14;
Renumbered Tables Sequentially.................................................. 11
Added Sensor Bandwidth Section and Figure 14;
Renumbered Figures Sequentially................................................ 13
Timing Specifications .................................................................. 5
Timing Diagrams.......................................................................... 5
ESD Caution.................................................................................. 6
Basic Operation ............................................................................ 9
Reading Sensor Data.................................................................... 9
Device Configuration .................................................................. 9
Rev. D | Page 2 of 20
Applications Information .............................................................. 17
Outline Dimensions ....................................................................... 18
Changes to Digital Filtering Section ............................................ 13
Changes to General-Purpose I/O Section................................... 14
Changes to Table 26 ....................................................................... 15
Changes to Table 29 and Table 31 ................................................ 16
Added Product Identification Section......................................... 16
Added Applications Information Section, Figure 16, Figure 17,
and Figure 18; Renumbered Figures Sequentially ..................... 17
4/09—Rev. 0 to Rev. A
Changes to Features Section ............................................................1
Changes to Scale Factor, Table 1......................................................3
Changes to Figure 5 and Figure 6....................................................7
Changes to Figure 7 and Figure 8....................................................8
Changes to Device Configuration Section.....................................9
Changes to Figure 12...................................................................... 10
Changes to Operational Control Section .................................... 12
1/09—Revision 0: Initial Version
Memory Map .............................................................................. 10
Burst Read Data Collection ...................................................... 11
Output Data Registers ............................................................... 11
Calibration................................................................................... 12
Operational Control................................................................... 12
Input/Output Functions ............................................................ 14
Diagnostics.................................................................................. 15
Product Identification................................................................ 16
Installation/Handling................................................................. 17
Gyroscope Bias Optimization................................................... 17
Input ADC Channel................................................................... 17
Interface Printed Circuit Board (PCB).................................... 17
Ordering Guide .......................................................................... 18