C8051T630DK Silicon Laboratories Inc, C8051T630DK Datasheet - Page 22
![KIT DEV FOR C8051T630 FAMILY](/photos/9/23/92351/c8051t630dk_sml.jpg)
C8051T630DK
Manufacturer Part Number
C8051T630DK
Description
KIT DEV FOR C8051T630 FAMILY
Manufacturer
Silicon Laboratories Inc
Type
MCUr
Specifications of C8051T630DK
Contents
Board, daughter boards, power adapter, cables, documentation and software
Processor To Be Evaluated
C8051T63x
Interface Type
USB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With/related Products
C8051T630, T631, T632, T633, T634 and T635 MCUs
For Use With
336-1465 - BOARD SOCKET DAUGHTER 20-QFN
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1464
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- Download datasheet (2Mb)
C8051T630/1/2/3/4/5
22
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
6. The stencil thickness should be 0.125mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
8. A 2x2 array of 0.95mm openings on a 1.1mm pitch should be used for the center pad to
9. A No-Clean, Type-3 solder paste is recommended.
10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for
C1
C2
X1
E
mask and the metal pad is to be 60m minimum, all the way around the pad.
to assure good solder paste release.
assure the proper paste volume (71% Paste Coverage).
Small Body Components.
Figure 4.2. QFN-20 Recommended PCB Land Pattern
Table 4.2. QFN-20 PCB Land Pattern Dimesions
0.20
Min
3.70
3.70
0.50
Max
0.30
Rev. 1.0
Dimension
X2
Y1
Y2
2.15
0.90
2.15
Min
Max
2.25
1.00
2.25
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