MCB2470 Keil, MCB2470 Datasheet - Page 71

• Manufacturer Part Number: MCB2470
• Description: BOARD EVAL NXP LPC247X SERIES
• Manufacturer: Keil
• Type: MCUr

Specifications of MCB2470

• Contents: Board, Cable, CD
• For Use With/related Products: LPC2478
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
Fig 18. Package outline SOT950-1 (TFBGA208)
LPC2478_1
Preliminary data sheet
TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
SOT950-1
OUTLINE
max
1.2
A
ball A1
index area
ball A1
index area
0.4
0.3
A
1
M
K
H
D
B
T
P
F
G
U
R
N
L
E
C
A
J
0.8
0.6
A
2
1
IEC
2
0.5
0.4
3
b
4
5
15.1
14.9
6
D
e
7
8
15.1
14.9
e
D
9
JEDEC
E
1
10
- - -
11
REFERENCES
12
0.8
e
13
Rev. 01 — 9 February 2007
0
14
12.8
15
e
b
1
16
17
12.8
JEITA
e
2
scale
5
B
e
0.15
v
w
v
e
A
E
M
M
2
0.08
C
C
w
A
10 mm
B
0.12
y
A
0.1
y
A
1
2
A
1
y
1
PROJECTION
EUROPEAN
C
detail X
Fast communication chip
C
X
y
LPC2478
© NXP B.V. 2007. All rights reserved.
ISSUE DATE
06-06-01
06-06-14
SOT950-1
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