C8051F326-TB Silicon Laboratories Inc, C8051F326-TB Datasheet - Page 30

• Manufacturer Part Number: C8051F326-TB
• Description: BOARD PROTOTYPING W/C8051F326
• Manufacturer: Silicon Laboratories Inc
• Type: MCUr

Specifications of C8051F326-TB

• Contents: Board
• Processor To Be Evaluated: C8051F326/F327
• Interface Type: USB
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• For Use With/related Products: C8051F326
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

C8051F326/7
30
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
6. The stencil thickness should be 0.125mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
8. A 3x3 array of 0.90mm openings on a 1.1mm pitch should be used for the center pad to
9. A No-Clean, Type-3 solder paste is recommended.
10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for
C1
C2
X1
E
mask and the metal pad is to be 60μm minimum, all the way around the pad.
to assure good solder paste release.
assure the proper paste volume (67% Paste Coverage).
Small Body Components.
Figure 4.4. QFN-28 Recommended PCB Land Pattern
Table 4.3. QFN-28 PCB Land Pattern Dimensions
0.20
Min
4.80
4.80
0.50
Max
0.30
Rev. 1.1
Dimension
X2
Y1
Y2
3.20
0.85
3.20
Min
Max
3.30
0.95
3.30