OM11024 NXP Semiconductors, OM11024 Datasheet - Page 22

KIT EVAL FOR LPC313X

OM11024

Manufacturer Part Number
OM11024
Description
KIT EVAL FOR LPC313X
Manufacturer
NXP Semiconductors
Type
Microcontrollerr
Datasheets

Specifications of OM11024

Contents
2 Boards, cable and software
For Use With/related Products
LPC3131
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-4719
NXP Semiconductors
LPC3130_3131
Preliminary data sheet
Fig 5.
masters
= master/slave connection supported by matrix
(1) LPC3131 only.
AHB MULTILAYER MATRIX
DMA
LPC3130/3131 multi-layer AHB matrix connections
0
1
926EJ-S
ARM
This module has the following features:
2
USB-OTG
MASTER
AHB
All information provided in this document is subject to legal disclaimers.
3
slaves
10
11
12
13
0
1
2
3
4
5
6
7
8
9
Rev. 1.04 — 27 May 2010
synchronous bridge
INTERRUPT CONTROLLER
asynchronous
asynchronous
asynchronous
asynchronous
BRIDGE 0
BRIDGE 1
BRIDGE 2
BRIDGE 3
BRIDGE 4
AHB-APB
AHB-APB
AHB-APB
AHB-APB
AHB-APB
USB HIGH-SPEED OTG
MPMC CONTROLLER
NAND CONTROLLER
bridge
bridge
bridge
bridge
MPMC CONFIG
MCI SD/SDIO
ISRAM 1
BUFFER
ISRAM 0
ISROM
Low-cost, low-power ARM926EJ-S microcontrollers
TIMER 0
EVENT ROUTER
PCM
DMA REGISTERS
(1)
0
0
0
0
0
LCD
I2S0/1
1
TIMER 1
1
UART
2
10-bit ADC
NAND REGISTERS
1
TIMER 2
2
LPC3130/3131
3
SPI
1
WDT
2
TIMER 3
RNG
6
3
SYSTEM CONTROL
© NXP B.V. 2010. All rights reserved.
IOCONFIG
PWM
4
5
3
002aae126
I2C0
5
CGU
4
22 of 72
I2C1
6

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