TLP3120 Toshiba, TLP3120 Datasheet

IC PHOTORELAY 80V 1.25A 6-SOP

TLP3120

Manufacturer Part Number
TLP3120
Description
IC PHOTORELAY 80V 1.25A 6-SOP
Manufacturer
Toshiba
Series
TLP3120r
Datasheet

Specifications of TLP3120

Circuit
SPST-NO (1 Form A)
Output Type
AC, DC
On-state Resistance
150 mOhm
Load Current
1.25A
Voltage - Input
1.15VDC
Voltage - Load
0 ~ 80 V
Mounting Type
Surface Mount
Termination Style
Gull Wing
Package / Case
6-SOP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TLP3120
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
2011-3
PRODUCT GUIDE
Photocouplers and Photorelays
S E M I C O N D U C T O R
h t t p : / / w w w . s e m i c o n . t o s h i b a . c o . j p / e n g

Related parts for TLP3120

TLP3120 Summary of contents

Page 1

... PRODUCT GUIDE Photocouplers and Photorelays 2011-3 ...

Page 2

... IEC380/VDE0806, IEC60950/EN60950 and IEC60065/EN60065. Small-Package Products Toshiba offers a wide variety of photocouplers in a small package to meet the space-saving requirement of increasingly smaller and thinner end products. Packaging options include mini-flat packages (MFSOPs) and half-pitch (1.27 mm) mini-flat SOP packages ...

Page 3

... TLP3063 S TLP3064 ( TLP3082 S 30 TLP3100 30 TLP3110 20 TLP3111 TLP3113 20 30 TLP3114 TLP3115 21 21 TLP3116 18 TLP3118 TLP3119 18 19 TLP3120 TLP3121 19 17 TLP3122 TLP3123 19 21 TLP3125 30 TLP3130 TLP3131 30 30 TLP320 TLP320 TLP3203 TLP320 Package Output Page DIP4 MOSFET (Photorelay) DIP8 MOSFET (Photorelay) DIP4 MOSFET (Photorelay) ...

Page 4

Product Index Part Number Package TLP3212 SSOP4 MOSFET (Photorelay) SSOP4 MOSFET (Photorelay) TLP3213 TLP3214 SSOP4 MOSFET (Photorelay) SSOP4 TLP3215 MOSFET (Photorelay) TLP3216 SSOP4 MOSFET (Photorelay) SSOP4 TLP3217 MOSFET (Photorelay) TLP3218 SSOP4 MOSFET (Photorelay) TLP3219 SSOP4 MOSFET (Photorelay) SSOP4 MOSFET ...

Page 5

... New Products Small Surface-Mount IC-Output Photocouplers in the SO8 Package Toshiba is expanding its portfolio of IC-output photocouplers in the small and thin SO8 package. To meet customer needs, Toshiba has released photocouplers featuring various data rates, dual-channel configurations and power device drivers. Data rate Part Number (typ ...

Page 6

... TLP2108 2-ch IC-Output Photocouplers for IPM Drive Applications Toshiba offers IC-output photocouplers ideal for IPM drive applications. Compared to the conventional TLP114A (IGM), these IC-output photocouplers provide shorter propagation delay times, a wider operating temperature range and digital output. Thus, they help to simplify system design and improve system performance ...

Page 7

... High-ION Photorelays: TLP354x Series (Under Development) Toshiba is now developing the TLP354x Series in the DIP6 package targeting applications that deal with relatively large current. Housed in the DIP6 package, the TLP354x photorelays allow B and C connections, enabling the switching of 8-A, 7-A, 6-A and 4-A dc current respectively ...

Page 8

... General-Purpose Photorelays Certified for Reinforced Insulation: TLP220 Series and TLP221A (Under Development) Toshiba is now developing the TLP220 Series and the TLP221 targeting factory equipment applications, and wattmeter and smart meter applications for the monitoring of electrical energy consumption. These photorelays meet the requirements for high isolation voltage between input and output, as well as for international safety standards certification ...

Page 9

... Photocoupler Product Tree Photocoupler Product Tree Package DIP4 DIP6 DIP8 DIP16 SO8 SOP4 2.54SOP4 2.54SOP6 Transistor-Output Photorelays Photorelays Thyristor- and Triac-Output Triac Output Thyristor Output ZC DIP4 DIP6 DIP8 DIP16 ● ≥ 7-mm clearance/creepage; ≥ 0.4-mm isolation thickness SDIP6 ● 6-pin SMD package (1.27-mm lead pitch) ● ...

Page 10

... Vrms High I 5000 Vrms F Darlington 2500 Vrms 2500 Vrms High V CEO 5000 Vrms *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. SOP16 SOP16 SO6 SO16 MFSOP6 Quad Single Quad Single ...

Page 11

... For the latest information, please contact your nearest Toshiba sales representative. Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item. (3) ...

Page 12

... Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. (3) CTR (%) ...

Page 13

... Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. (3) CTR (%) ...

Page 14

... Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item. Note 5: For safety standard compliance criteria including the operating temperature conditions, please contact your nearest Toshiba representative. ...

Page 15

... For the latest information, please contact your nearest Toshiba sales representative. Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item. (3) ...

Page 16

... For the latest information, please contact your nearest Toshiba sales representative. Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item. (3) ...

Page 17

... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

Page 18

... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

Page 19

... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

Page 20

... Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜ ...

Page 21

... Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜ ...

Page 22

... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

Page 23

... TLP701A* ± 0.6 A (max) TLP701H* TLP705A* TLP700 ± 2.0 A (max) TLP700H* ± 2.5 A (max) *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Propagation Delay Time Output Form/CTR Features (Max) 800 ns 25% ...

Page 24

... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

Page 25

... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

Page 26

... TLP3102 TLP3275 TLP173A † TLP175A* TLP170A TLP172A TLP192A TLP176A TLP197A TLP3212 TLP3110 TLP3122 TLP3103 TLP3218 TLP3118 TLP3111 TLP3217 TLP3219 TLP3119 TLP3121 TLP3120 TLP3220 TLP3105 TLP179D TLP199D TLP170D TLP176D TLP197D TLP170G TLP172G TLP192G TLP174G TLP176G TLP197G TLP176GA TLP197GA TLP174GA TLP170J 26 2.54SOP8 DIP4 ...

Page 27

... OFF * Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

Page 28

... OFF Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜ ...

Page 29

... I : 2.5 A (max) @Ta 50˚C ON 2.54SOP6 TLP3102 I (DC (max); C-connection ON 2.54SOP6 TLP3103 I (DC) = 4.6 A (max); C-connection ON 2.54SOP6 TLP3105 I (DC) = 2.8 A (max); C-connection ON 2.54SOP6 TLP3120 Lead pitch : 2. 1.25 A (max 2.54SOP8 TLP3125 Lead pitch: 2. 410 pF (typ.) OFF Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. ...

Page 30

... Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

Page 31

... SEMKO-approved Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜ ...

Page 32

... SEMKO-approved Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜ ...

Page 33

... Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜV and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. R (Max ...

Page 34

... TLP168J 4000 Vrms 5000 Vrms 800 V 5000 Vrms *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. NZC: Non-zero cross ZC: Zero cross Triac-Output Photocouplers for Solid State Relays ( SSRs ) Part Number Pin Configuration ...

Page 35

... Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜV and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. I (Max) V (Max) ...

Page 36

... Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜV and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. I (Max) V (Max) ...

Page 37

... Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜV and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. I (Max) V (Max) ...

Page 38

... Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd. For detailed information, please contact your nearest Toshiba sales representative. MFSOP6 ...

Page 39

... Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd. For detailed information, please contact your nearest Toshiba sales representative. BVs ...

Page 40

... Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd. For detailed information, please contact your nearest Toshiba sales representative. Off-State ...

Page 41

... Note: The length of part names is limited to 18 characters. Longer names are abbreviated by omitting the “-“ character and/or using shorthand symbols. However, be sure to give full part names when you have any inquiries. For details, please contact your nearest Toshiba sales representative. ...

Page 42

Package Information 1 Lead Form Options for DIP Packages The DIP4, DIP6, DIP8 and DIP16 packages offer three surface-mount lead form options and a wide-spaced lead form option. The electrical characteristics are identical, regardless of these options. Lead Form ...

Page 43

Package Dimensions ( 4-Pin DIP ) Standard DIP4 4.58 ± 0.25 7.62 ± 0.25 1.2 ± 0.15 0.5 ± 0.1 7.85 to 8.80 2.54 ± 0.25 DIP4 (LF2 10.16 ± 0.25 ...

Page 44

Package Information 2 Package Dimensions ( 6-Pin DIP ) Standard DIP6 7.12 ± 0.25 0.5 ± 0.1 1.2 ± 0.15 2.54 ± 0.25 DIP6 (LF2 7.12 ± ...

Page 45

Package Dimensions ( 8-Pin DIP ) Standard DIP8 9.66 ± 0.25 1.2 ± 0.15 0.5 ± 0.1 2.54 ± 0.25 DIP8 (LF2 9.66 ...

Page 46

Package Information 2 Package Dimensions ( Other DIP Packages ) 5-pin DIP6 7.12 ± 0.25 0.5 ± 0.1 1.2 ± 0.15 2.54 ± 0.25 5-pin DIP (with Pin 5 Cut ...

Page 47

Package Dimensions ( Surface Mount ) SDIP6 4.58 ± 0. 7.62 ± 0.25 1.27 ± 0.2 1.25 ± 0.2 0.4 ± 0.1 9.7 ± 0.3 4-pin MFSOP6 7.0 ± ...

Page 48

Package Information 2 Package Dimensions ( Surface Mount ) 2.54SOP4 3.9 ± 0.25 0.4 ± 0.1 2.54 ± 0.25 2.54SOP8 9.4 ± 0.25 2.54 ± 0.25 0.4 ...

Page 49

... Transistor-output photocouplers are ranked according to their CTR ranges, whereas thyristor-output and triac-output photocouplers are ranked according to their maximum I Note that the rank classifications differ from product to product. For details, please refer to the relevant technical datasheets. 1. CTR Rank Name and Rank Marking Available CTR Rank Selection ( ●: Available, ▲: Contact Toshiba) Part Number None GB ...

Page 50

... TLP620: TLP620 Examples Part number TLP666GF: TLP666GF CTR or I rank marking FT Pin No. 1 rank in parentheses to the standard part number. FT Use this part number TLP181 50 I Rank Marking FT Blank, T7 (only for photorelays) : TLP626: P626 TLP620: P620 P620 TLP620 TLP181: P181 TLP620 TLP620 ...

Page 51

Packing Information 1 Photocoupler Magazine Packing Specifications Magazine Dimensions Device Package Pin Count Quantities per Magazine Quantity (pcs Packing Dimensions A Number of Magazines Standard DIP DIPs with LF1, LF2, LF4 and LF5 Lead ...

Page 52

Packing Information Unit: mm SO6 10.5 4.8 Magazine Dimensions 4.7 Length = 555 Thickness = 0.5 Package 5 Device Pin Count (SO6) Quantities per Magazine Quantity (pcs) 125 B Packing Dimensions Package SO6 MFSOP6 SO8 Photocoupler Package Type MFSOP6 ...

Page 53

Tape-and-Reel Specifications The tape specifications differ for photocouplers manufactured in Thailand. 1. Embossed Tape Specifications for Surface-Mount Lead Form Options Photocoupler Package Types MFSOP6, SO6 SO8 SOP4 SOP16 2.54SOP4 2.54SOP6 2.54SOP8 SSOP4 SDIP6 DIP(LF1, LF5) DIP(LF4) 2. Tape Dimensions ...

Page 54

Packing Information 3. Reel Dimensions U E ø380 mm Photocoupler MFSOP, SO6 SO8 SOP4 Package Type ( TPL ) , ( TPR ) ( Tape Option ø380 ± ...

Page 55

... Labels with “ Please contact your TOSHIBA sales representative for details as to environmental matters such as the The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment ...

Page 56

Board Assembly 1 Example Land Patterns Below are the example land patterns for surface-mount packages. Mini-flat and SOP couplers 0.8 2.54 MFSOP6 (4-Pin) [e.g., TLP181] MFSOP6 (5-Pin) [e.g., TLP114A] 2.54SOP4 [e.g., TLP197G] SO6 (4-Pin) [e.g., TLP265J] 1.27 1.27 1.27 ...

Page 57

... Example of temperature profile of lead (Pb) solder c. Example of temperature profile of lead (Pb)-free solder The profile below shows only the typical temperature profile and conditions, which might not apply to all Toshiba photocouplers. Temperature profiles and conditions may differ from product to product. Refer to the relevant technical datasheets and databooks when mounting a device. (° ...

Page 58

... Projected Operating Life Based on LED Light Output Degradation Toshiba photocouplers use one of four types of LEDs and a projection of the operating life has been made for each LED. The table on page 57 shows the types of LED used in photocouplers and the figures on pages show projections of long-term light output performance and operating life ...

Page 59

LEDs Used in Photocouplers GaA LED LED: GaAs LED 1 2 Photocouplers LED Photocouplers 4N25 ( SHORT ) 1 TLP160 Series 4N25A ( SHORT ) 1 TLP161 Series 4N26 ( SHORT ) 1 TLP163 4N27 ( ...

Page 60

Device Degradation GaAs LED Projected Light Output Degradation Data 1 Test conditions mA 40°C F 140 120 100 100 1000 Test time (h) Test conditions ...

Page 61

GaA As (SH) LED Projected Light Output Degradation Data Test conditions mA 40°C F 140 120 100 100 1000 Test time (h) Test conditions ...

Page 62

Device Degradation GaA As (DH) LED Projected Light Output Degradation Data 3 Test conditions mA 40°C F 140 120 100 100 1000 Test time (h) Test conditions: ...

Page 63

... GaA As (MQW) LED Projected Light Output Degradation and Operating Life Data Toshiba is now preparing the light output degradation and operating life data for GaA As LEDs. These data are available for individual LEDs. Ask your local Toshiba sales representative ...

Page 64

Device Degradation Reading the Projected LED Operating Life Graph For example, let's calculate the operating life of the GaAs LED, based on the data shown on page 60. Here is an example of how to read an operating life, ...

Page 65

... Safety Standard Approvals Toshiba offers a wide selection of photocouplers with a transistor output, IC output, thyristor output and triac output, as well as photore- lays certified to UL (USA), cUL (Canada), VDE (Germany), BSI (Britain) and SEMKO (Sweden). Safety Standard Approvals for Photocouplers Reflective Photocouplers in Mechanical Construction ...

Page 66

... Devices Triac/Thyrsitor Output The table above lists photocouplers and photorelays that have already been approved as of January 2011. The information herein is subject to change. For the latest information, please contact your nearest Toshiba sales representative. (DIN EN60747-5-2) (Continued) Single-Molded Packages Coupling Medium ...

Page 67

Photocoupler Application Circuit Examples 1 Digital Interface Applications High Speed TLP118, TLP2601 7 390 Ω LSTTL Low Input Current Drive TLP553 0 4.7 kΩ kΩ CMOS ...

Page 68

Photocoupler Application Circuit Examples 2 Inverter and AC-DC Servo Applications [ Photo-IC couplers: high-speed base/gate drive applications ] GTR Direct Drive TLP109 / TLP2409 IGBT / TLP550 / TLP559 Power MOS Direct Drive TLP759 High-Speed (Numerical control, Robotics) Driving ...

Page 69

Driving the Gate of a 50-A-Class IGBT Module TLP350 0.1 μ 390 Ω LSTTL Driving the Gate of a 400-A-Class IGBT Module TLP351/ TLP2541 8 1 0.1 μF ...

Page 70

Photocoupler Application Circuit Examples 3 Home Appliance Applications Electric Oven/Grills Magnetron Thermo-Switch Grill Heater Oven- TLP560G Cavity Lamp 120 Vac 50/60 Hz Door-Detector Circuit Weight Sensor Gas Sensor Refrigerator Block Diagram Panel Input Door Switch Temperature Sensor Door-Open Monitor ...

Page 71

Automatic Washing Machines M Drain Valve Water Supply Valve 100 Vac Fan Heaters (1)Block Diagram Panel Main Switch Adjustment Switches Display Speaker Room Temperature Sensor Preheat Sensor Earthquake Sensor TLP560G ...

Page 72

Photocoupler Application Circuit Examples 4 Home Appliance Applications (2)Waveform Examples 1. Example of Operating Waveform for Burner Motor Top: waveforms Medium: Bottom: Horizontal: Inverter Air Conditioners Remote Control Panel Microcontroller for Indoor Control Panel Unit Room Temperature Sensor Temperature ...

Page 73

... TLP225A /TLP222A Input for Sequencers 1 2 Limit Switches ● Thermostats ● Transducer ● DC-AC 3 Inputs 4 COMMON 120-/240-Vac Output for Sequencers and Solid State Relays (SSRs) Logic Processor Logic Inputs TLP127 /TLP627 +100 V Load +48 V Load TLP280-4 TLP160G /TLP525G TLP166J /TLP561J ZC 73 ...

Page 74

Photocoupler Application Circuit Examples 6 SSR and Power Control Circuit Applications Zero-Crossing Phototriac Output: TLP561G/TLP561J and Mini-Flat TLP161G/TLP166J TLP161G/ TLP561G/ TLP3042 ( S ) TLP166J / TLP561J / TLP3062 ( TLP3082 ( TLP3782 ...

Page 75

... TLP748J Note 1: EN60747-approved with option (D4) Note 2: The EN60747-5-2 safety standard for compact packages is different from those for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. *: Double protection Filter Switching ...

Page 76

Photocoupler Application Circuit Examples 8 Push-Button Telephone Application A variety of photocouplers are used to isolate between telephone lines (L1 and L2) and a CPU. Line Detector TLP629 TLP320 Application Package Type DIP4 TLP781 Ring ...

Page 77

... Photovoltaic Coupler Applications TLP190B TLP590B TLP191B TLP591B Transformerless AC-DC converter TLP590B x n 100 Aac 10 Photorelays for Tester Application TLP3120 /TLP3122 /TLP3542 Power Source Timing Generator CPU Pattern Generator 11 Photorelay ( MOSFET Output ) Application L 1 Switch Signal + This is the simplest power MOSFET drive circuit. ...

Page 78

... TLP280 TLP281 Half-Pitch Mini-Flat Coupler 13 Competitor Part Number Cross Reference Search The Toshiba Semiconductor webpage at http://www.semicon.toshiba.co.jp/eng/product/opto/selection/coupler/xref/index.html offers a cross reference search tool for photocouplers and photorelays. No need for output snubber circuit ● ● No need for reverse-blocking diode in input side Off-Hook Relay ...

Page 79

... MOC3043-M TLP3051 ( S ) TLP127 MOC3051-M TLP3052 ( S ) TLP627 MOC3052-M TLP3061 ( S ) TLP371 MOC3061-M TLP3062 ( S ) TLP372 MOC3062-M TLP3063 ( S ) TLP330 MOC3063-M 79 Avago Part Number Toshiba Part Number HCPL-M600 TLP118 HCPL-M601 TLP118 HCPL-M611 TLP118 HCPL-M452 TLP109 HCPL-M453 TLP109 HCPL-M456 TLP109 HCPL-2601 TLP2601 HCPL-2611 TLP2601 HCPL-2201 TLP555 HCPL-2530 ...

Page 80

... Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise ...

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