ESDALC6V1M3 STMicroelectronics, ESDALC6V1M3 Datasheet
ESDALC6V1M3
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ESDALC6V1M3
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ESDALC6V1M3 Summary of contents
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... Cellular phone handsets and accessories ■ Video equipment October 2010 2 Figure 1. Description The ESDALC6V1M3 is a monolithic array designed to protect 1 line or 2 lines against ESD transients. The device is ideal for applications where both reduced line capacitance and board space saving are required. TM: Transil is a trademark of STMicroelectronics ...
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... Breakdown voltage Leakage current @ V RM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Breakdown current Voltage temperature coefficient Forward voltage drop = 25 °C) amb Test condition = 30 mV OSC Doc ID 11555 Rev 5 ESDALC6V1M3 Value ± 15 ± initial = amb 3 -40 + 125 -55 + 150 260 ...
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... ESDALC6V1M3 Figure 3. Relative variation of peak pulse power versus initial junction temperature 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0 (°C) 0 Figure 5. Clamping voltage versus peak pulse current (typical values) I (A) PP 10.0 8/20 µ °C initial 1.0 0 Figure 7. Junction capacitance versus ...
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... Figure 12. Analog crosstalk measurements 0.00 0.00 - 30.00 - 30.00 - 60.00 - 60.00 - 90.00 - 90.00 - 120.00 - 120.00 100.0M 100.0M 1.0G 1.0G Doc ID 11555 Rev 5 ESDALC6V1M3 (-15 kV air discharge) on each channel between channels dB F (Hz) 100.0k 100.0k 1.0M 1.0M 10.0M 10.0M 100.0M 100.0M Xtalk Xtalk 1.0G ...
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... ESDALC6V1M3 2 Ordering information Figure 13. Ordering information scheme ESD array Low capacitance Breakdown voltage 6V1 = 6.1 Volts min. Package M3 = SOT883 Doc ID 11555 Rev 5 Ordering information ESDA LC 6V1 M3 5/12 ...
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... Figure 14. Footprint 0.40 0.20 0.25 6/12 Ref Figure 15. Marking 0.40 0.70 0.30 All dimensions in mm Doc ID 11555 Rev 5 ESDALC6V1M3 Dimensions Millimeters Min. Typ. Max. Min. A 0.40 0.50 0.016 A1 0.00 0.05 0.00 b1 0.10 0.15 0.20 0.004 0.006 0.007 b2 0.45 0.50 0.55 0.018 0.020 0.021 D 0 ...
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... ESDALC6V1M3 Figure 16. Packing information 0.20 All dimensions in mm Cathode bar 2.0 0.6 0.68 User direction of unreeling Doc ID 11555 Rev 5 Package information Ø 1.55 4.0 2.0 7/12 ...
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... Stencil opening for leads: Opening to footprint ratio 90%. Figure 18. Recommended stencil window position 10 µm 10 µm 8/ ---- - = 1 --------------------------- - = 0. 400 µm 7 µm 380 µm 7 µm 10 µm 10 µm 0.20 18 µm 380 µm 18 µm 400 µm Doc ID 11555 Rev 5 ESDALC6V1M3 W T=100 µm 0.4 0.4 0.70 0.25 0.30 Footprint Stencil window Footprint ...
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... ESDALC6V1M3 4.2 Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Solder paste with fine particles: powder particle size is 20-45 µm. 4.3 Placement 1. Manual positioning is not recommended. ...
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... Note: Minimize air convection currents in the reflow oven to avoid component movement. 10/12 3°C/s max 3°C/s max 150 sec 90 to 150 sec Doc ID 11555 Rev 5 ESDALC6V1M3 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max Time (min) Time (min) 10-30 sec 10-30 sec ...
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... ESDALC6V1M3 5 Ordering information Table 4. Ordering information Order code ESDALC6V1M3 1. The marking can be rotated by 90° to differentiate assembly location 6 Revision history Table 5. Document revision history Date 04-Aug-2005 23-May-2006 16-Jun-2006 18-Feb-2007 26-Oct-2010 Marking Package Weight (1) K SOT883 0.86 mg Revision 1 Initial release. Reformated to current standards. Added soldering reflow profile 2 diagram ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 12/12 Please Read Carefully: © 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com Doc ID 11555 Rev 5 ESDALC6V1M3 ...