ESDAULC6-3BF2 STMicroelectronics, ESDAULC6-3BF2 Datasheet
ESDAULC6-3BF2
Specifications of ESDAULC6-3BF2
ESDAULC6-3BF2
Available stocks
Related parts for ESDAULC6-3BF2
ESDAULC6-3BF2 Summary of contents
Page 1
... MIL STD 883G-Method 3015-7: class 3B Rev 1 ESDAULC6-3BP6 ESDAULC6-3BF2 Flip-Chip ESDAULC6-3BF2 Functional diagram GND I/O1 GND I/O3 I/O2 I/O3 Bump side view ESDAULC6-3BF2 Pin configuration I/O1 I/O2 I/O3 GND Order codes Marking (contact discharge (air discharge) HBM (Human Body Model) www.st.com 1 2 1/11 11 ...
Page 2
... Parameter IEC 61000-4-2 contact discharge (1) IEC 61000-4-2 air discharge = 25° C) amb Parameter Test condition = 2.5 µ SOT-666 = Flip-Chip OSC SOT-666 = 1. 4 400 mV Flip-Chip OSC ESDAULC6-3BP6, ESDAULC6-3BF2 Value (min.) Unit 150 -55 to +150 260 Slope: 1 Min Typ Max 6.0 9.2 0.5 1 ...
Page 3
... ESDAULC6-3BP6, ESDAULC6-3BF2 Figure 3. Relative variation of peak pulse power versus initial junction temperature (SOT-666 initial initial=25° 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 T (° Figure 5. Peak pulse power versus exponential pulse duration (SOT-666) P (W) PP 1000 100 t (µ ...
Page 4
... Figure 14. Remaining voltage after 0.1 µs/div ESDAULC6-3BP6, ESDAULC6-3BF2 reverse voltage applied (typical values) (Flip-Chip) V (V) LINE current versus junction temperature (typical values) (Flip-Chip (° 100 ESDAULC6-3BF2 during ESD 15 kV positive surge (air discharge) (Flip-Chip) 0.1 µs/div F=1MHz V =30mV OSC RMS T =25° 125 ...
Page 5
... Line 2 Figure 20. Analog crosstalk measurements 0.00 - 20.00 - 40.00 - 60.00 - 80.00 - 100.00 - 120.00 - 140.00 100.0M 300.0M 1.0G 3.0G Characteristics ESDAULC6-3BF2 during ESD 15 kV negative surge (air discharge) (Flip-Chip) 0.1 µs/div results of channel 1 (Flip-Chip (Hz) 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M Line 1 between channels (Flip-Chip) ...
Page 6
... Application examples 2 Application examples Figure 21. USB2.0 (high speed) protection application schematic V BUS GND Figure 22. Audio jack protection application schematic Figure 23. SIM card protection application schematic RST CLK DATA GND 6/11 Audio jack 100pF ESDAULC6-3BP6, ESDAULC6-3BF2 IC to Protect FM Tuner SIM CARD PROCESSOR ...
Page 7
... ESDAULC6-3BP6, ESDAULC6-3BF2 3 Ordering information scheme ESD Array Ultra low capacitance Breakdown Voltage Volts Number of lines protected lines Type B = Bidirectional Packages F2 = Flip-Chip P6 = SOT-666 Ordering information scheme ESDA ULC 7/11 ...
Page 8
... Figure 24. SOT-666 footprint (dimensions in mm) 8/11 Ref 0.50 0.99 0.30 ESDAULC6-3BP6, ESDAULC6-3BF2 Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. 0.45 0.60 0.018 0.08 0.18 0.003 0.17 0.34 0.007 0.19 0.27 0.34 0.007 0.011 0.013 1.50 1.70 0.059 1.50 1.70 0.059 1 ...
Page 9
... ESDAULC6-3BP6, ESDAULC6-3BF2 Figure 25. Flip-Chip dimensions Figure 26. Flip-Chip footprint Copper pad Diameter: 220 µm recommended Solder stencil opening: 330 µmrecommended Solder mask opening recommendation: 300 µmrecommended Figure 28. Flip-Chip tape and reel specifications 0.71 +/- 0.05 All dimensions order to meet environmental requirements, ST offers these devices in ECOPACK® ...
Page 10
... Ordering information Table 5. Ordering information Part number ESDAULC6-3BP6 ESDAULC6-3BF2 6 Revision history Table 6. Revision history Datet 03-Jul-2007 10/11 Marking Package 3 SOT-666 3B Flip-Chip Revision 1 Initial release ESDAULC6-3BP6, ESDAULC6-3BF2 Weight Base qty Delivery mode 2.9 mg 5000 Tape and reel 2.22 mg 5000 Tape and reel Changes ...
Page 11
... ESDAULC6-3BP6, ESDAULC6-3BF2 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...