ESDAULC6-8F3 STMicroelectronics, ESDAULC6-8F3 Datasheet
ESDAULC6-8F3
Specifications of ESDAULC6-8F3
Related parts for ESDAULC6-8F3
ESDAULC6-8F3 Summary of contents
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... Description The ESDAULC6-8F3 is a monolithic application specific discrete device dedicated to ESD protection of high speed differential interfaces. This device is ideal for applications where both reduced print circuit board space and power absorption capability are required. ...
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... Symbol per line I/O-GND line 2 °C) amb Parameter Parameter Breakdown voltage Leakage current @ V RM Stand-off voltage Breakdown current = 25 °C) amb Test condition = 30 mV MHz osc Doc ID 16859 Rev 2 ESDAULC6-8F3 Value Unit 150 Min. Typ. Max. Unit 100 1.2 kV °C ° ...
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... ESDAULC6-8F3 Figure 4. S21(dB) attenuation measurement S21 (dB) 0.00 -1.00 -2.00 3.00 - 4.00 30M 100M 300M 1.0G 3.0G 300k 1.0M 3.0M 10M Figure 6. Digital crosstalk measurement 500 mV/Div C2 20 mV/Div C3 Figure 8. ESD response to IEC 61000-4-2 (-8 kV contact discharge) 50 V/Div VCL C2 Figure 5. 0.0 -30 -60 ...
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... C(fF) 1000 800 600 400 200 0 1.0E-02 1.0E- 1K75 5V CEC B2 SCL SDA HPD ESDAULC6-8F3 Doc ID 16859 Rev 2 ESDAULC6-8F3 F(GHz) 1.0E+00 1.0E+01 TYPE C HDMI CONNECTOR 1 TMDS DATA2 SHIELD 2 TMDS DATA2 + 3 TMDS DATA2 - 4 TMDS DATA1 SHIELD 5 TMDS DATA1 + 6 TMDS DATA1 - 7 TMDS DATA0 SHIELD 8 ...
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... ESDAULC6-8F3 3 Ordering information scheme Figure 12. Ordering information scheme ESD array Ultra low capacitance Breakdown voltage min. Number of protected lines 8 = eight lines Package F = Flip-Chip 3 = Lead-free, pitch 400 µm 4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ...
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... AN2348: "Flip Chip: Package description and recommendations for use" AN1751: "EMI Filters: Recommendations and measurements" 6/8 Figure 15. Marking Dot, ST logo ECOPACK ® Grade xx = maring z = manufacturing location yww = datecode (y = year ww = week) 4.0 ± 0.1 4.0 ± 0.1 1.30 User direction of unreeling Doc ID 16859 Rev 2 ESDAULC6-8F3 Ø 1.5 ± 0.1 ...
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... ESDAULC6-8F3 5 Ordering information Table 3. Ordering information Order code ESDAULC6-8F3 6 Revision history Table 4. Document revision history Date 06-Oct-2010 15-Oct-2010 Marking Package ER Flip Chip Revision 1 First issue. 2 Corrected typographical error in document title. Doc ID 16859 Rev 2 Ordering information Weight Base qty Delivery mode 1.88 mg 5000 Tape and reel (7” ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 8/8 Please Read Carefully: © 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com Doc ID 16859 Rev 2 ESDAULC6-8F3 ...