ESDAULC6-1U2 STMicroelectronics, ESDAULC6-1U2 Datasheet
ESDAULC6-1U2
Specifications of ESDAULC6-1U2
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ESDAULC6-1U2 Summary of contents
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... Portable multimedia device and accessories Digital camera and camcorder Communication and highly integrated systems Description The ESDAULC6-1U2 is a unidirectional single line TVS diode designed to protect the data lines or other I/O ports against ESD transients. The device is ideal for applications where both reduced line capacitance and board space saving are required ...
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... IPP = 1 A, 8/20 µ [200 MHz - 3000 MHz], V line 2/ °C) amb Parameter ( Slope = 1 °C) amb Min Doc ID 023270 Rev 1 ESDAULC6-1U2 Value Unit 1.4 A -40 to 150 ° +150 °C 260 ° ...
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... ESDAULC6-1U2 Figure 3. Variation of leakage current versus junction temperature (typical values (nA) 100.00 10.00 1.00 0.10 0. Figure 5. ESD response to IEC 61000-4-2 (+8 kV contact discharge) 20 V/div Figure 7. S21 attenuation measurement results S21 (dB (0.8 – 4GHz -10 100k Figure 4. ...
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... Ordering information scheme 2 Ordering information scheme Figure 8. Ordering information scheme 4/10 ESD Array Ultralow capacitance Breakdown Voltage min Number of lines 1 = Single line Package U2 = ST0201 Doc ID 023270 Rev 1 ESDAULC6-1U2 ESDA ULC ...
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... ESDAULC6-1U2 3 Package information Epoxy meets UL94, V0 Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. Table 3. ...
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... Package information Figure 11. Tape and reel specifications 0.22 0.34 All dimensions are typical values in mm 6/10 Bar indicates Pin 1 4.0 2.0 0.38 User direction of unreeling Doc ID 023270 Rev 1 ESDAULC6-1U2 Ø 1.55 2.0 ...
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... ESDAULC6-1U2 4 Recommendation on PCB assembly 4.1 Stencil opening design Figure 12. Recommended stencil windows position (dimensions in mm) 4.2 Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed 4. Solder paste with fine particles: powder particle size is 20-45 µm. ...
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... Note: Minimize air convection currents in the reflow oven to avoid component movement. 8/10 240-245 ° °C/s 0.9 °C 120 150 180 Doc ID 023270 Rev 1 ESDAULC6-1U2 -2 °C °C/s -6 °C/s max 60 sec (90 max) Time (s) 210 240 270 300 ...
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... ESDAULC6-1U2 5 Ordering information Table 4. Ordering information Order code ESDAULC6-1U2 1. The marking can be rotated by multiples of 180° to differentiate assembly location 6 Revision history Table 5. Document revision history Date 05-Jun-2012 Marking Weight (1) V1 0.124 mg Revision 1 Initial release. Doc ID 023270 Rev 1 Ordering information Base qty ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 10/10 Please Read Carefully: © 2012 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com Doc ID 023270 Rev 1 ESDAULC6-1U2 ...