ESDAULC6-1U2 STMicroelectronics, ESDAULC6-1U2 Datasheet - Page 8

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ESDAULC6-1U2

Manufacturer Part Number
ESDAULC6-1U2
Description
TVS Diodes - Transient Voltage Suppressors Single-Line Uni ESD 0.8pF 0201 SMD LVL4
Manufacturer
STMicroelectronics
Series
ESDAULC6r
Datasheet

Specifications of ESDAULC6-1U2

Rohs
yes
Polarity
Unidirectional
Breakdown Voltage
6 V
Clamping Voltage
13 V
Peak Surge Current
1.4 A
Package / Case
ST0201
Minimum Operating Temperature
- 40 C
Maximum Operating Temperature
+ 150 C
Capacitance
0.8 pF
Channels
1 Channel
Mounting Style
SMD/SMT
Peak Pulse Power Dissipation
18 W
Termination Style
SMD/SMT

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ESDAULC6-1U2
Manufacturer:
ST
Quantity:
20 000
Part Number:
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Manufacturer:
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Recommendation on PCB assembly
4.3
4.4
4.5
Note:
8/10
Placement
1.
2.
3.
4.
5.
6.
PCB design preference
1.
2.
Reflow profile
Figure 13. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Minimize air convection currents in the reflow oven to avoid component movement.
Manual positioning is not recommended.
It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering
Standard tolerance of ± 0.05 mm is recommended.
3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
To control the solder paste amount, the closed via is recommended instead of open
vias.
The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
250
200
150
100
50
0
Temperature (°C)
30
0.9 °C/s
60
Doc ID 023270 Rev 1
90
120
2 - 3 °C/s
150
240-245 °C
180
(90 max)
60 sec
210
240
Time (s)
270
-2 °C/s to
-3 °C/s
-6 °C/s max
300
ESDAULC6-1U2

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