NUP1301,215 NXP Semiconductors, NUP1301,215 Datasheet
NUP1301,215
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NUP1301,215 Summary of contents
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NUP1301 Ultra low capacitance ESD protection array Rev. 01 — 11 May 2009 1. Product profile 1.1 General description Ultra low capacitance ElectroStatic Discharge (ESD) protection array in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package designed to protect ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number NUP1301 4. Marking Table 4. Type number NUP1301 [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol ...
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... NXP Semiconductors Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol I FSM Per device tot amb T stg [1] Pulse test prior to surge. j [3] Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5. [4] Measured from pin 3 to pins 1 and 2 (pins 1 and 2 are connected). ...
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... NXP Semiconductors 120 100 % (%) Fig 1. 8/20 s pulse waveform according to IEC 61000-4-5 6. Thermal characteristics Table 8. Symbol Per device R th(j-a) R th(j-sp) [1] Single diode loaded. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. NUP1301_1 Product data sheet 001aaa630 Fig 2. Thermal characteristics ...
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... NXP Semiconductors 7. Characteristics Table unless otherwise specified. amb Symbol Per diode Per device V CL [1] Pulse test: t [2] Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5. [3] Measured from pin 3 to pins 1 and 2 (pins 1 and 2 are connected). NUP1301_1 Product data sheet ...
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... NXP Semiconductors (mA (1) (2) (3) ( 0.2 0.4 0.6 0.8 ( 150 C amb ( amb ( amb ( amb Fig 3. Forward current as a function of forward voltage; typical values ( ( ( ( ( 150 C amb ( amb ( amb ( amb Fig 5. Reverse current as a function of reverse voltage; typical values NUP1301_1 Product data sheet 006aab132 ...
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... NXP Semiconductors ESD TESTER acc. to IEC 61000-4 150 pF 330 GND unclamped +8 kV ESD pulse waveform (IEC 61000-4-2 network) GND unclamped 8 kV ESD pulse waveform (IEC 61000-4-2 network) Fig 7. ESD clamping test setup and waveforms NUP1301_1 Product data sheet RG 223/U 50 coax 450 ...
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... NXP Semiconductors 8. Application information Protection of a single (high-speed) data line in rail-to-rail configuration. The protected data line is connected to pin 3. Pin 1 is connected to ground (GND) and pin 2 is connected to the supply rail (supply voltage V voltage drop of one diode, the transient is directed either to the supply rail or to GND. ...
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... NXP Semiconductors 10. Package outline Fig 9. 11. Packing information Table 10. The indicated -xxx are the last three digits of the 12NC ordering code. Type number NUP1301 [1] For further information and the availability of packing methods, see NUP1301_1 Product data sheet 3.0 2.8 2.5 1.4 2 ...
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... NXP Semiconductors 12. Soldering 3 1.7 Fig 10. Reflow soldering footprint SOT23 (TO-236AB) 4.6 2.6 Fig 11. Wave soldering footprint SOT23 (TO-236AB) NUP1301_1 Product data sheet 3.3 2.9 1 2 1.4 2.8 4.5 Rev. 01 — 11 May 2009 NUP1301 Ultra low capacitance ESD protection array 2 0 ...
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... NXP Semiconductors 13. Revision history Table 11. Revision history Document ID Release date NUP1301_1 20090511 NUP1301_1 Product data sheet Ultra low capacitance ESD protection array Data sheet status Change notice Product data sheet - Rev. 01 — 11 May 2009 NUP1301 Supersedes - © NXP B.V. 2009. All rights reserved. ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 16. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Application information Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 9.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 8 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 11 Packing information ...