DSPIC30F2011-20I/P Microchip Technology, DSPIC30F2011-20I/P Datasheet - Page 205

• Manufacturer Part Number: DSPIC30F2011-20I/P
• Description: IC DSPIC MCU/DSP 12K 18DIP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F2011-20I/P

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 12
• Program Memory Size: 12KB (4K x 24)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 18-DIP (0.300", 7.62mm)
• Core Frequency: 40MHz
• Core Supply Voltage: 5.5V
• Embedded Interface Type: I2C, SPI, UART
• No. Of I/o's: 12
• Flash Memory Size: 12KB
• Supply Voltage Range: 2.5V To 5.5V
• Package: 18PDIP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 3.3|5 V
• Data Bus Width: 16 Bit
• Number Of Programmable I/os: 12
• Interface Type: I2C/SPI/UART
• On-chip Adc: 8-chx12-bit
• Number Of Timers: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC30F005 - MODULE SCKT DSPIC30F 18DIP/SOICACICE0202 - ADAPTER MPLABICE 18P 300 MIL
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: DSPIC30F2011-20IP

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
© 2008 Microchip Technology Inc.
Architecture
Trademark
Example:
dsPIC30F3013AT-30I/SP = 30 MIPS, Industrial temp., SPDIP package, Rev. A
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Device ID
Flash
d s P I C 3 0 F 3 0 1 3 AT- 3 0 I / S P - E S
dsPIC30F2011/2012/3012/3013
Temperature
I = Industrial -40°C to +85°C
E = Extended High Temp -40°C to +125°C
Package
P
SO = SOIC
SP = SPDIP
ML = QFN (8x8)
A,B,C… = Revision Level
Custom ID (3 digits) or
Engineering Sample (ES)
= DIP
T = Tape and Reel
DS70139F-page 205
Speed
20 = 20 MIPS
30 = 30 MIPS