PIC18F6410-I/PT Microchip Technology, PIC18F6410-I/PT Datasheet - Page 35

IC PIC MCU FLASH 8KX16 64TQFP

PIC18F6410-I/PT

Manufacturer Part Number
PIC18F6410-I/PT
Description
IC PIC MCU FLASH 8KX16 64TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F6410-I/PT

Program Memory Type
FLASH
Program Memory Size
16KB (8K x 16)
Package / Case
64-TFQFP
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
54
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
SPI/I2C/EUSART/AUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
54
Number Of Timers
4
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM183032
Minimum Operating Temperature
- 40 C
On-chip Adc
12-ch x 10-bit
Package
64TQFP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT64PT5 - SOCKET TRAN ICE 64MQFP/TQFPAC164319 - MODULE SKT MPLAB PM3 64TQFPDV007003 - PROGRAMMER UNIVERSAL PROMATE II
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F6410-I/PT
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PIC18F6410-I/PT
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Microchip Technology
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3.0
3.1
PIC18F6310/6410/8310/8410 devices can be operated
in ten different oscillator modes. The user can program
the Configuration bits, FOSC<3:0>, in Configuration
Register 1H to select one of these ten modes:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10. ECIO
3.2
In XT, LP, HS or HSPLL Oscillator modes, a crystal or
ceramic resonator is connected to the OSC1 and
OSC2 pins to establish oscillation.
the pin connections.
The oscillator design requires the use of a parallel
resonant crystal.
 2010 Microchip Technology Inc.
Note:
LP
XT
HS
HSPLL High-Speed Crystal/Resonator
RC
RCIO
INTIO1 Internal Oscillator with F
INTIO2 Internal Oscillator with I/O on RA6
EC
OSCILLATOR
CONFIGURATIONS
Oscillator Types
Crystal Oscillator/Ceramic
Resonators
Use of a series resonant crystal may give a
frequency out of the crystal manufacturer’s
specifications.
Low-Power Crystal
Crystal/Resonator
High-Speed Crystal/Resonator
with PLL enabled
External Resistor/Capacitor with
F
External Resistor/Capacitor with I/O
on RA6
on RA6 and I/O on RA7
and RA7
External Clock with F
External Clock with I/O on RA6
OSC
/4 output on RA6
OSC
Figure 3-1
OSC
/4 output
/4 output
PIC18F6310/6410/8310/8410
shows
FIGURE 3-1:
TABLE 3-1:
Capacitor values are for design guidance only.
These capacitors were tested with the resonators
listed below for basic start-up and operation. These
values are not optimized.
Different capacitor values may be required to produce
acceptable oscillator operation. The user should test
the performance of the oscillator over the expected
V
See the notes following
information.
Note 1: See
DD
Mode
HS
XT
and temperature range for the application.
C1
C2
2: A series resistor (R
3: R
455 kHz
2.0 MHz
(1)
(1)
Typical Capacitor Values Used:
C1 and C2.
strip cut crystals.
F
16.0 MHz
455 kHz
2.0 MHz
4.0 MHz
8.0 MHz
varies with the oscillator mode chosen.
XTAL
R
Table 3-1
Freq
S
(2)
Resonators Used:
CAPACITOR SELECTION FOR
CERAMIC RESONATORS
OSC2
OSC1
16.0 MHz
CRYSTAL/CERAMIC
RESONATOR OPERATION
(XT, LP, HS OR HSPLL
CONFIGURATION)
and
Table 3-2
Table 3-2
S
) may be required for AT
OSC1
56 pF
47 pF
33 pF
27 pF
22 pF
R
F
(3)
PIC18FXXXX
4.0 MHz
8.0 MHz
DS39635C-page 35
for initial values of
Sleep
for additional
OSC2
56 pF
47 pF
33 pF
27 pF
22 pF
To
Internal
Logic

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