PIC24HJ64GP502-E/MM Microchip Technology, PIC24HJ64GP502-E/MM Datasheet - Page 16

• Manufacturer Part Number: PIC24HJ64GP502-E/MM
• Description: IC PIC MCU FLASH 64K 28-QFN
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ64GP502-E/MM

• Program Memory Type: FLASH
• Program Memory Size: 64KB (22K x 24)
• Package / Case: 28-QFN
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, PMP, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 21
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Processor Series: PIC24HJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C/SPI/UART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 21
• Number Of Timers: 5
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM300027
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10-ch x 10-bit or 10-ch x 12-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164336 - MODULE SOCKET FOR PM3 28/44QFN
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC24HJ32GP302/304, PIC24HJ64GPX02/X04 AND PIC24HJ128GPX02/X04
FIGURE 2-1:
2.2.1
On boards with power traces running longer than six
inches in length, it is suggested to use a tank capacitor
for integrated circuits including MCUs to supply a local
power source. The value of the tank capacitor should
be determined based on the trace resistance that
connects the power supply source to the device, and
the maximum current drawn by the device in the
application. In other words, select the tank capacitor so
that it meets the acceptable voltage sag at the device.
Typical values range from 4.7 µF to 47 µF.
2.3
A low-ESR (< 5 Ohms) capacitor is required on the
V
regulator output voltage. The V
connected to V
4.7 µF and 10 µF, 16V connected to ground. The type
can be ceramic or tantalum. Refer to
“Electrical
information.
The placement of this capacitor should be close to the
V
exceed one-quarter inch (6 mm). Refer to
“On-Chip Voltage Regulator”
DS70293E-page 16
CAP
CAP
Ceramic
V
0.1 µF
DD
R
. It is recommended that the trace length not
C
pin, which is used to stabilize the voltage
R1
CPU Logic Filter Capacitor
Connection (V
TANK CAPACITORS
10 Ω
Tantalum
MCLR
V
V
10 µF
DD
SS
DD
Characteristics”
, and must have a capacitor between
RECOMMENDED
MINIMUM CONNECTION
PIC24H
Ceramic
0.1 µF
CAP
for details.
)
CAP
pin must not be
for
V
V
DD
Section 28.0
Section 25.2
SS
Ceramic
0.1 µF
Ceramic
0.1 µF
additional
Ceramic
0.1 µF
2.4
The MCLR pin provides for two specific device
functions:
• Device Reset
• Device programming and debugging
During device programming and debugging, the
resistance and capacitance that can be added to the
pin must be considered. Device programmers and
debuggers drive the MCLR pin. Consequently,
specific voltage levels (V
transitions must not be adversely affected. Therefore,
specific values of R and C will need to be adjusted
based on the application and PCB requirements.
For
recommended that the capacitor C, be isolated from
the MCLR pin during programming and debugging
operations.
Place the components shown in
one-quarter inch (6 mm) from the MCLR pin.
FIGURE 2-2:
Note 1: R ≤ 10 kΩ is recommended. A suggested
example,
2: R1 ≤ 470Ω will limit any current flowing into
Master Clear (MCLR) Pin
starting value is 10 kΩ. Ensure that the
MCLR pin V
MCLR from the external capacitor C, in the
event of MCLR pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR pin
V
V
IH
DD
R
JP
C
and V
as
IL
shown
EXAMPLE OF MCLR PIN
CONNECTIONS
IH
specifications are met.
R1
© 2011 Microchip Technology Inc.
and V
IH
and V
IL
MCLR
in
specifications are met.
PIC24H
IL
Figure
Figure 2-2
) and fast signal
2-2,
within
it
is