PIC24HJ64GP502-E/MM Microchip Technology, PIC24HJ64GP502-E/MM Datasheet - Page 304

• Manufacturer Part Number: PIC24HJ64GP502-E/MM
• Description: IC PIC MCU FLASH 64K 28-QFN
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ64GP502-E/MM

• Program Memory Type: FLASH
• Program Memory Size: 64KB (22K x 24)
• Package / Case: 28-QFN
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, PMP, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 21
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Processor Series: PIC24HJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C/SPI/UART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 21
• Number Of Timers: 5
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM300027
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10-ch x 10-bit or 10-ch x 12-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164336 - MODULE SOCKET FOR PM3 28/44QFN
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC24HJ32GP302/304, PIC24HJ64GPX02/X04 AND PIC24HJ128GPX02/X04
FIGURE 28-11:
TABLE 28-30: SPIx MASTER MODE (FULL-DUPLEX, CKE = 1, CKP = x, SMP = 1) TIMING
DS70293E-page 304
AC CHARACTERISTICS
SP10
SP20
SP21
SP30
SP31
SP35
SP36
SP40
SP41
Note 1:
Param
No.
SCKx
(CKP = 0)
SCKx
(CKP = 1)
SDOx
SDIx
Note: Refer to
2:
3:
4:
TscP
TscF
TscR
TdoF
TdoR
TscH2doV,
TscL2doV
TdoV2sc,
TdoV2scL
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
These parameters are characterized, but are not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated.
The minimum clock period for SCKx is 111 ns. The clock generated in Master mode must not violate this
specification.
Assumes 50 pF load on all SPIx pins.
Symbol
REQUIREMENTS
Figure 28-1
SPIx MASTER MODE (FULL-DUPLEX, CKE = 1, CKP = X, SMP = 1) TIMING
CHARACTERISTICS
Maximum SCK Frequency
SCKx Output Fall Time
SCKx Output Rise Time
SDOx Data Output Fall Time
SDOx Data Output Rise Time
SDOx Data Output Valid after
SCKx Edge
SDOx Data Output Setup to
First SCKx Edge
Setup Time of SDIx Data
Input to SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
SP40
Characteristic
for load conditions.
SP36
MSb In
MSb
SP41
(1)
SP10
SP30, SP31
SP35
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Min
30
30
30
—
—
—
—
—
—
Bit 14 - - - -1
Bit 14 - - - - - -1
Typ
—
—
—
—
—
—
—
—
6
(2)
Max
20
—
—
—
—
—
—
—
9
SP21
SP20
-40°C ≤ T
-40°C ≤T
LSb In
Units
LSb
MHz
© 2011 Microchip Technology Inc.
ns
ns
ns
ns
ns
ns
ns
ns
A
A
SP20
SP21
≤ +85°C for Industrial
≤+125°C for Extended
See Note 3
See parameter
and Note 4
See parameter
and Note 4
See parameter
and Note 4
See parameter
and Note 4
Conditions
—
—
—
—
DO32
DO31
DO32
DO31