PIC16F876-20/SO Microchip Technology, PIC16F876-20/SO Datasheet - Page 197

IC MCU FLASH 8KX14 EE 28SOIC

PIC16F876-20/SO

Manufacturer Part Number
PIC16F876-20/SO
Description
IC MCU FLASH 8KX14 EE 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F876-20/SO

Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
MSSP, PSP, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 70 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
0 C
On-chip Adc
10 bit, 5 Channel
Package
28SOIC W
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Data Rom Size
256 B
A/d Bit Size
10 bit
A/d Channels Available
5
Height
2.31 mm
Length
17.87 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4 V
Width
7.49 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F876-20/SO
Manufacturer:
MCI
Quantity:
56
Part Number:
PIC16F876-20/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
44-Lead Plastic Metric Quad Flatpack (PQ) 10x10x2 mm Body, 1.6/0.15 mm Lead Form (MQFP)
2001 Microchip Technology Inc.
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-022
Drawing No. C04-071
B
c
p
#leads=n1
Dimension Limits
E1
E
Units
(F)
CH
A2
D1
n1
A1
E1
A
E
D
B
n
p
L
c
n
MIN
L
2
1
.079
.077
.002
.029
.510
.510
.390
.390
.005
.012
.025
D1 D
0
5
5
CH x 45
INCHES
NOM
A
.086
.080
.006
.035
.063
.520
.520
.394
.394
.007
.015
.035
.031
3.5
44
10
10
11
MAX
A1
(F)
.093
.083
.010
.530
.530
.398
.398
.009
.018
.045
.041
15
15
7
MIN
12.95
12.95
2.00
1.95
0.05
0.73
9.90
9.90
0.13
0.30
0.64
MILLIMETERS*
0
5
5
NOM
PIC16F87X
13.20
13.20
10.00
10.00
0.80
2.18
2.03
0.15
0.88
1.60
0.18
0.38
0.89
3.5
44
10
10
11
A2
DS30292C-page 195
MAX
13.45
13.45
10.10
10.10
2.35
2.10
0.25
1.03
0.23
0.45
1.14
15
15
7

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