PIC16F876-20/SO Microchip Technology, PIC16F876-20/SO Datasheet - Page 94

• Manufacturer Part Number: PIC16F876-20/SO
• Description: IC MCU FLASH 8KX14 EE 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F876-20/SO

• Program Memory Type: FLASH
• Program Memory Size: 14KB (8K x 14)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 22
• Eeprom Size: 256 x 8
• Ram Size: 368 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 368 B
• Interface Type: MSSP, PSP, USART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 22
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
• Minimum Operating Temperature: 0 C
• On-chip Adc: 10 bit, 5 Channel
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 20 MHz
• Data Rom Size: 256 B
• A/d Bit Size: 10 bit
• A/d Channels Available: 5
• Height: 2.31 mm
• Length: 17.87 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4 V
• Width: 7.49 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC16F87X
9.2.18.2
During a Repeated START condition, a bus collision
occurs if:
a)
b)
When the user de-asserts SDA and the pin is allowed
to float high, the BRG is loaded with SSPADD<6:0>
and counts down to 0. The SCL pin is then de-asserted,
and when sampled high, the SDA pin is sampled. If
SDA is low, a bus collision has occurred (i.e., another
master is attempting to transmit a data’0’). If, however,
FIGURE 9-23:
FIGURE 9-24:
DS30292C-page 92
A low level is sampled on SDA when SCL goes
from low level to high level.
SCL goes low before SDA is asserted low, indi-
cating that another master is attempting to trans-
mit a data ’1’.
SDA
SCL
BCLIF
RSEN
S
SSPIF
SDA
SCL
RSEN
BCLIF
S
SSPIF
Bus Collision During a Repeated
START Condition
’0’
’0’
’0’
’0’
BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
BUS COLLISION DURING REPEATED START CONDITION (CASE 2)
SCL goes low before SDA,
Set BCLIF. Release SDA and SCL.
T
BRG
Sample SDA when SCL goes high.
If SDA = 0, set BCLIF and release SDA and SCL.
SDA is sampled high, the BRG is reloaded and begins
counting. If SDA goes from high to low before the BRG
times out, no bus collision occurs, because no two
masters can assert SDA at exactly the same time.
If, however, SCL goes from high to low before the BRG
times out and SDA has not already been asserted, a
bus collision occurs. In this case, another master is
attempting to transmit a data’1’ during the Repeated
START condition.
If at the end of the BRG time-out, both SCL and SDA
are still high, the SDA pin is driven low, the BRG is
reloaded and begins counting. At the end of the count,
regardless of the status of the SCL pin, the SCL pin is
driven low and the Repeated START condition is
complete (Figure 9-23).
T
Cleared in software
BRG
2001 Microchip Technology Inc.
Interrupt cleared
in software
’0’
’0’
’0’
’0’