LPC3250FET296/01,5 NXP Semiconductors, LPC3250FET296/01,5 Datasheet - Page 46

IC ARM9 MCU 256K 296-TFBGA

LPC3250FET296/01,5

Manufacturer Part Number
LPC3250FET296/01,5
Description
IC ARM9 MCU 256K 296-TFBGA
Manufacturer
NXP Semiconductors
Series
LPC32x0r
Datasheets

Specifications of LPC3250FET296/01,5

Package / Case
296-TFBGA
Core Processor
ARM9
Core Size
16/32-Bit
Speed
266MHz
Connectivity
EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, Motor Control PWM, PWM, WDT
Number Of I /o
51
Program Memory Type
ROMless
Ram Size
256K x 8
Voltage - Supply (vcc/vdd)
0.9 V ~ 3.6 V
Data Converters
A/D 3x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC32
Core
ARM926EJ-S
Data Bus Width
32 bit
Data Ram Size
256 KB
Interface Type
EMC
Maximum Clock Frequency
266 MHz
Number Of Timers
6
Operating Supply Voltage
1.31 V to 1.39 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, DK-57TS-LPC3250, DK-57VTS-LPC3250, SOMDIMM-LPC3250
Development Tools By Supplier
OM11016, OM11021, OM11045
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 3 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4962
935290766551

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC3250FET296/01,5
Manufacturer:
TI
Quantity:
250
Part Number:
LPC3250FET296/01,5
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Part Number:
LPC3250FET296/01,5
Manufacturer:
NXP/恩智浦
Quantity:
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Part Number:
LPC3250FET296/01,551
Quantity:
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NXP Semiconductors
Table 7.
T
LPC3220_30_40_50_1
Preliminary data sheet
Symbol
I
V
V
V
I
I
I
C
V
I
I
I
ONSW pin
V
V
V
I
I
I
I
I
Z
Reset pin
2
IL
IH
latch
OL
OZ
OLS
OH
OL
OZ
OHS
OLS
amb
o
C pins
I
IH
IL
OL
O
OH
OL
i
= 40 C to +85 C, unless otherwise specified.
Parameter
input voltage
HIGH-level
input voltage
LOW-level
input voltage
LOW-level
input current
HIGH-level
input current
I/O latch-up current
input capacitance
LOW-level
output voltage
LOW-level
output current
OFF-state
output current
LOW-level short-circuit
output current
output voltage
HIGH-level
output voltage
LOW-level
output voltage
HIGH-level
output current
LOW-level
output current
OFF-state
output current
HIGH-level short-circuit
output current
LOW-level short-circuit
output current
output impedance
Static characteristics
…continued
Conditions
1.8 V inputs
3.3 V inputs
1.8 V inputs
3.3 V inputs
V
V
(1.5V
Excluding bonding
pad capacitance
1.8 V outputs; I
3.3 V outputs; I
V
V
V
no pull-up/down
V
V
V
V
1.2 V outputs; I
1.2 V outputs; I
V
V
V
no pull-up/down
V
V
V
(1.5V
I
I
DD(IO)
DD(IO)
O
DD(IO)
DD(IO)
DD(IO)
DD(IO)
OH
OL
O
DD(1V2)
OL
DD(1V2)
= 0 V; no pull-up
= V
= 0 V; V
= 0 V; V
= 0.4 V
= V
= V
DD(IO)
DD(IO)
DD(IO)
= 1.8 V; V
= 3.3 V; V
= 1.8 V; V
= 3.3 V; V
DD(1V2)
DD(1V2)
= 1.8 V; V
= 1.2 V
)
; no pull-down
O
O
Rev. 01 — 6 February 2009
) < V
= V
= V
OL
OL
OH
OL
I
DD(IO)
DD(1V2)
0.4 V
OL
OL
OL
OL
<
= 4 mA
= 4 mA
= 4 mA
= 1 mA
OH
= 0.4 V
= 0.4 V
=
=
= 0 V
;
;
[8][12]
[8][13]
[13]
[10][11]
[8][12]
[8][12]
[8][13]
[8][9]
[10]
[12]
[12]
[12]
[12]
[8]
[8]
[8]
[8]
[8]
Min
0
0.7
0.7
-
-
-
-
-
-
-
-
3
3
-
-
-
0
V
-
3
-
-
-
40
4
DD(1V2)
V
V
LPC3220/30/40/50
DD(IO)
DD(IO)
0.4
16/32-bit ARM microcontrollers
Typ
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
[1]
Max
5.5V
-
-
0.3
0.3
10
10
100
1.6
0.4
0.4
-
-
10
40
40
V
-
0.4
-
-
1.5
135
60
135
DD(1V2)
© NXP B.V. 2009. All rights reserved.
V
V
DD(IO)
DD(IO)
46 of 73
Unit
V
V
V
V
V
mA
pF
V
V
mA
mA
mA
mA
V
V
V
mA
mA
mA
mA
A
A
A
A

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