LPC1767FBD100,551 NXP Semiconductors, LPC1767FBD100,551 Datasheet - Page 35

IC ARM CORTEX MCU 512K 100-LQFP

LPC1767FBD100,551

Manufacturer Part Number
LPC1767FBD100,551
Description
IC ARM CORTEX MCU 512K 100-LQFP
Manufacturer
NXP Semiconductors
Series
LPC17xxr

Specifications of LPC1767FBD100,551

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
100MHz
Connectivity
Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 3.6 V
Data Converters
A/D 8x12b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Processor Series
LPC17
Core
ARM Cortex M3
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB1760, MCB1760U, MCB1760UME
For Use With
622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
568-4967
935289808551

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC1767FBD100,551
Quantity:
9 999
Part Number:
LPC1767FBD100,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
LPC1768_67_66_65_64_3
Product data sheet
7.29.8 Power domains
The LPC17xx provide two independent power domains that allow the bulk of the device to
have power removed while maintaining operation of the RTC and the backup Registers.
On the LPC17xx, I/O pads are powered by the 3.3 V (V
V
CPU and most of the peripherals.
Depending on the LPC17xx application, a design can use two power options to manage
power consumption.
The first option assumes that power consumption is not a concern and the design ties the
V
supply for both pads, the CPU, and peripherals. While this solution is simple, it does not
support powering down the I/O pad ring “on the fly” while keeping the CPU and
peripherals alive.
The second option uses two power supplies; a 3.3 V supply for the I/O pads (V
a dedicated 3.3 V supply for the CPU (V
powered independently from the I/O pad ring enables shutting down of the I/O pad power
supply “on the fly”, while the CPU and peripherals stay active.
The VBAT pin supplies power only to the RTC domain. The RTC requires a minimum of
power to operate, which can be supplied by an external battery. The device core power
(V
there is no power drain from the RTC battery when V
DD(REG)(3V3)
DD(3V3)
DD(REG)(3V3)
and V
pin powers the on-chip voltage regulator which in turn provides power to the
) is used to operate the RTC whenever V
DD(REG)(3V3)
Rev. 03 — 19 November 2009
pins together. This approach requires only one 3.3 V power
DD(REG)(3V3)
LPC1768/67/66/65/64
32-bit ARM Cortex-M3 microcontroller
). Having the on-chip voltage regulator
DD(REG)(3V3)
DD(REG)(3V3)
DD(3V3)
) pins, while the
is available.
is present. Therefore,
© NXP B.V. 2009. All rights reserved.
DD(3V3)
35 of 65
) and

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