MC9S08QG4CDTE Freescale Semiconductor, MC9S08QG4CDTE Datasheet - Page 35

• Manufacturer Part Number: MC9S08QG4CDTE
• Description: IC MCU 4K FLASH 10MHZ 16-TSSOP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QG4CDTE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 12
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-TSSOP
• Processor Series: S08QG
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 1
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08QG8E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 20MHz
• Total Internal Ram Size: 256Byte
• # I/os (max): 12
• Number Of Timers - General Purpose: 1
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 16
• Package Type: TSSOP
• Package: 16TSSOP
• Family Name: HCS08
• Maximum Speed: 20 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Chapter 3
Modes of Operation
3.1
The operating modes of the MC9S08QG8/4 are described in this section. Entry into each mode, exit from
each mode, and functionality while in each mode are described.
3.2
3.3
Run is the normal operating mode for the MC9S08QG8/4. This mode is selected upon the MCU exiting
reset if the BKGD/MS pin is high. In this mode, the CPU executes code from internal memory with
execution beginning at the address fetched from memory at 0xFFFE:0xFFFF after reset.
3.4
The active background mode functions are managed through the background debug controller (BDC) in
the HCS08 core. The BDC, together with the on-chip debug module (DBG), provides the means for
analyzing MCU operation during software development.
Active background mode is entered in any of five ways:
Freescale Semiconductor
•
•
•
•
•
•
•
•
Active background mode for code development
Wait mode:
— CPU halts operation to conserve power
— System clocks running
— Full voltage regulation is maintained
Stop modes: CPU and bus clocks stopped
— Stop1: Full powerdown of internal circuits for maximum power savings
— Stop2: Partial powerdown of internal circuits; RAM contents retained
— Stop3: All internal circuits powered for fast recovery; RAM and register contents are retained
When the BKGD/MS pin is low during POR or immediately after issuing a background debug
force reset (see
When a BACKGROUND command is received through the BKGD pin
When a BGND instruction is executed
When encountering a BDC breakpoint
When encountering a DBG breakpoint
Introduction
Features
Run Mode
Active Background Mode
5.8.3, “System Background Debug Force Reset Register
MC9S08QG8 and MC9S08QG4 Data Sheet, Rev. 5
(SBDFR)”)
33