MC9S12D64VPVE Freescale Semiconductor, MC9S12D64VPVE Datasheet - Page 8

IC MCU 64K FLASH 25MHZ 112-LQFP

MC9S12D64VPVE

Manufacturer Part Number
MC9S12D64VPVE
Description
IC MCU 64K FLASH 25MHZ 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheets

Specifications of MC9S12D64VPVE

Core Processor
HCS12
Core Size
16-Bit
Speed
25MHz
Connectivity
CAN, I²C, SCI, SPI
Peripherals
PWM, WDT
Number Of I /o
91
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.25 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
112-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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MC9S12DJ64 Device User Guide — V01.20
6.1
6.1.1
6.2
6.2.1
6.3
6.3.1
6.4
6.5
6.5.1
6.6
Section 7 Clock and Reset Generator (CRG) Block Description
7.1
Section 8 Oscillator (OSC) Block Description
8.1
Section 9 Enhanced Capture Timer (ECT) Block Description
Section 10 Analog to Digital Converter (ATD) Block Description
Section 11 Inter-IC Bus (IIC) Block Description
Section 12 Serial Communications Interface (SCI) Block Description
Section 13 Serial Peripheral Interface (SPI) Block Description
Section 14 J1850 (BDLC) Block Description
Section 15 Pulse Width Modulator (PWM) Block Description
Section 16 Flash EEPROM 64K Block Description
Section 17 EEPROM 1K Block Description
Section 18 RAM Block Description
Section 19 MSCAN Block Description
8
CPU12 Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
HCS12 Module Mapping Control (MMC) Block Description . . . . . . . . . . . . . . . . . . . . . .77
HCS12 Multiplexed External Bus Interface (MEBI) Block Description . . . . . . . . . . . . . .77
HCS12 Interrupt (INT) Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
HCS12 Background Debug (BDM) Block Description . . . . . . . . . . . . . . . . . . . . . . . . . .78
HCS12 Breakpoint (BKP) Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
Device-specific information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
Device-specific information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
Device-specific information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
Device-specific information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
Device-specific information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
Device-specific information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78

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