MC9S12D64VPVE Freescale Semiconductor, MC9S12D64VPVE Datasheet - Page 93

• Manufacturer Part Number: MC9S12D64VPVE
• Description: IC MCU 64K FLASH 25MHZ 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12D64VPVE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I²C, SCI, SPI
• Peripherals: PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 112-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

A.1.9 I/O Characteristics
This section describes the characteristics of all 5V I/O pins. All parameters are not always applicable, e.g.
not all pins feature pull up/down resistances.
Num C
NOTES:
1. The values for thermal resistance are achieved by package simulations
2. PC Board according to EIA/JEDEC Standard 51-3
3. PC Board according to EIA/JEDEC Standard 51-7
10
1
2
3
4
5
6
7
8
9
T Thermal Resistance LQFP112, single sided PCB
T
T Junction to Board LQFP112
T Junction to Case LQFP112
T Junction to Package Top LQFP112
T Thermal Resistance QFP 80, single sided PCB
T
T Junction to Board QFP80
T Junction to Case QFP80
T Junction to Package Top QFP80
Thermal Resistance LQFP112, double sided PCB
with 2 internal planes
Thermal Resistance QFP 80, double sided PCB with
2 internal planes
Table A-5 Thermal Package Characteristics
3
Rating
2
Symbol
JA
JA
JB
JC
JA
JA
JB
JC
JT
JT
MC9S12DJ64 Device User Guide — V01.20
Min
–
–
–
–
–
–
–
–
–
–
1
Typ
–
–
–
–
–
–
–
–
–
–
Max
54
41
31
11
51
41
27
14
2
3
o
o
o
o
o
o
o
o
o
o
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
93