MAXQ2000-RAX+ Maxim Integrated Products, MAXQ2000-RAX+ Datasheet - Page 38

• Manufacturer Part Number: MAXQ2000-RAX+
• Description: IC MCU 32K FLASH 68-QFN
• Manufacturer: Maxim Integrated Products
• Series: MAXQ™r

Specifications of MAXQ2000-RAX+

• Core Processor: RISC
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: 1-Wire, SPI, UART/USART
• Peripherals: LCD, POR, PWM, WDT
• Number Of I /o: 50
• Program Memory Size: 64KB (32K x 16)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 2.75 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 68-QFN Exposed Pad
• Processor Series: MAXQ
• Core: RISC
• Data Bus Width: 16 bit
• Data Ram Size: 2 KB
• Interface Type: JTAG, SPI
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 55
• Number Of Timers: 3
• Operating Supply Voltage: 2.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Controller Family/series: MAXQ
• No. Of I/o's: 50
• Ram Memory Size: 2048Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• Embedded Interface Type: SPI, UART
• Rohs Compliant: Yes
• Development Tools By Supplier: MAXQ2000-KIT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Low-Power LCD Microcontroller
38
REVISION
NUMBER
0
1
2
3
4
5
6
7
8
9
____________________________________________________________________
REVISION
DATE
10/04
10/04
12/04
10/05
12/06
6/05
1/06
3/06
6/06
3/08
Initial release for QFN package variant.
New product release for TQFN package variant.
In the Features section under Peripheral Features, corrected accumulator to
show 48 bits (not 40 bits).
In the Electrical Characteristics table, added Active Current line for 2.2V,
20MHz flash operation; V
updated V
Replaced the package drawing for 56-pin package.
Added lead-free part numbers to the Ordering Information table.
In the Electrical Characteristics table under LCD Segment Voltage, clarified
wording on V
ISEGxx to 3μA.
Clarified that flash memory write/erase cycles and data retention specifications
are at +25°C.
Clarified V
values (0.8 x V
test program values (0.8 x V
presented values to test program values (0.2 x V
affect the testing or operation of the device.
Corrected typo on pin 38 (Pin Configuration) from P4/
Corrected Pb-free package number denotations. Should be MAXQ2000-RAX+
and MAXQ2000-RBX+.
Added Revision A3 typ and max conditions to I
Characteristics table.
Added 100-pin LQFP package.
Added EP lines and note to QFN and TQFN pin configurations.
Changed 4kWords Utility ROM (Memory Organization section) to 4kB.
Changed 4k x 16 Utility ROM (Figure 1) to 2k x 16 Utility ROM, changed 8FFFh
to 87FFh.
Changed 4kWord to 4kB (Utility ROM section).
Added V
Corrected references of
In the
rate specification is met.
Added QFN and TQFN package codes to the
removed package drawings and replaced with
Typical Operating
DD
IH
IH1
slew rate specification to
, V
ADJ
/V
IL
DDIO
IH3
, V
spec to V
OH
specifications, matching presented values to test program
); clarified VIH2 specification, matching presented values to
, and V
Circuit, added the reset monitor to ensure the V
IH2(MIN)
ADJ(MIN)
LCD
OL
to
data to match GBD/FTEC data.
); clarified V
DESCRIPTION
changed from 0.8 x V
.
= V
Electrical Characteristics
ADJ
and V
IL2
Ordering Information
specification, matching
Package Information
DD6
ADJ(MAX)
DDIO
in the Electrical
). These changes do not
DDIO
to P5.4/
= 0.1V; changed
to 0.75 x V
table.
.
table;
table.
DDIO
DD
Revision History
;
slew
1, 7–11, 30, 35, 42
CHANGED
1, 30, 34
PAGES
33, 34
2, 3
2, 3
5, 6
38
33
13
14
15
36
37
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