PIC16F636-I/ST Microchip Technology, PIC16F636-I/ST Datasheet - Page 154

• Manufacturer Part Number: PIC16F636-I/ST
• Description: IC MCU FLASH 2KX14 14TSSOP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F636-I/ST

• Program Memory Type: FLASH
• Program Memory Size: 3.5KB (2K x 14)
• Package / Case: 14-TSSOP
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, LVD, POR, WDT
• Number Of I /o: 11
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: RS- 232/SPI/USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 2
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit
• Package: 14TSSOP
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 20 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162057 - MPLAB ICD 2 HEADER 14DIP
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC12F635/PIC16F636/639
15.3
DS41232B-page 152
DC CHARACTERISTICS
D010E
D011E
D012E
D013E
D014E
D015E
D016E
D017E
D018E
Legend:
Note 1:
Param
No.
2:
3:
4:
† Data in ‘Typ’ column is at 5.0V, 25 C unless otherwise stated. These parameters are for design guidance only
DC Characteristics: PIC12F635/PIC16F636-E (Extended)
I
DD
TBD = To Be Determined
and are not tested.
The test conditions for all I
rail-to-rail; all I/O pins tri-stated, pulled to V
The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact
on the current consumption.
The peripheral current is the sum of the base I
eral is enabled. The peripheral
limit. Max values should be used when calculating total current consumption.
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
Sym
Supply Current
Device Characteristics
(1,2)
DD
measurements in Active Operation mode are: OSC1 = external square wave, from
current can be determined by subtracting the base I
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Min
Preliminary
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
DD
; MCLR = V
DD
Typ†
TBD
TBD
TBD
or I
190
330
220
370
600
140
260
180
320
580
340
500
800
180
320
580
110
2.1
2.4
18
35
70
9
PD
and the additional current consumed when this periph-
DD
Max
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
; WDT disabled.
Units
mA
mA
mA
-40 C
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
T
V
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
4.5
5.0
A
DD
© 2005 Microchip Technology Inc.
+125 C for extended
F
LP Oscillator mode
F
XT Oscillator mode
F
XT Oscillator mode
F
EC Oscillator mode
F
EC Oscillator mode
F
LFINTOSC
F
IHFINTOSC
F
EXTRC mode
F
HS Oscillator mode
DD
OSC
OSC
OSC
OSC
OSC
OSC
OSC
OSC
OSC
Conditions
or I
= 32.768 kHz
= 1 MHz
= 4 MHz
= 1 MHz
= 4 MHz
= 31 kHz
= 4 MHz
= 4 MHz
= 20 MHz
PD
DD
current from this
.
Note