PIC16F636-I/ST Microchip Technology, PIC16F636-I/ST Datasheet - Page 171

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PIC16F636-I/ST

Manufacturer Part Number
PIC16F636-I/ST
Description
IC MCU FLASH 2KX14 14TSSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F636-I/ST

Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
14-TSSOP
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, LVD, POR, WDT
Number Of I /o
11
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
RS- 232/SPI/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit
Package
14TSSOP
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162057 - MPLAB ICD 2 HEADER 14DIP
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Price
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0
15.11 AC Characteristics: Analog Front-End for PIC16F639 (industrial, extended) (Continued)
© 2005 Microchip Technology Inc.
AC CHARACTERISTICS
Note 1:
Param
No.
*
2:
T
T
LFDATA
T
LFDATA
T
C
T
T
T
Sym.
T
F
T
T
ALARM
C_Q
Parameter is characterized but not tested.
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested.
Required output enable filter high time must account for input path analog delays = T
Required output enable filter low time must account for input path analog delays (= T
INACT
T
T
PAGC
R
STAB
PRES
TUNZ
AGC
RDY
OSC
GAP
DR
DF
LC
R Rise time of LFDATA
F Fall time of LFDATA
LCZ Tuning Capacitor
Q of Trimming Capacitors
Demodulator Charge Time
(delay time of demodulated output
to rise)
Demodulator Discharge Time
(delay time of demodulated output
to fall)
AGC stabilization time
High time after AGC settling time
AGC stabilization time plus high
time (after AGC settling time)
(T
Gap time after AGC settling time
Time from exiting Sleep or POR to
being ready to receive signal
Minimum time AGC level must be
held after receiving AGC Preserve
command
Internal RC oscillator frequency
(±10%)
Inactivity timer time-out
Alarm timer time-out
LC Pin Input Impedance
LCX, LCY, LCZ
AGC
+ T
PAGC
Characteristic
)
Standard Operating Conditions (unless otherwise stated)
Supply Voltage
Operating temperature
LC Signal Input
Carrier Frequency
LCCOM connected to V
44.1
28.8
14.4
28.8
Min
50*
200
PIC12F635/PIC16F636/639
5*
4
Preliminary
Typ†
62.5
3.5*
0.5
0.5
63
50
50
32
16
32
1*
0
SS
Max
81.9
35.2
17.6
35.2
50*
2.0V
-40°C
-40°C
Sinusoidal 300 mV
125 kHz
MOhm Device in Standby mode
Units
kHz
OEL
ms
ms
ms
ms
ms
ms
OEH
pF
pF
pF
s
s
s
s
s
s
V
T
T
DD
+ T
- T
AMB
AMB
V
Config. Reg. 3, bits<6:1> Setting = 000000
63 pF +/- 30%
Config. Reg. 3, bits<6:1> Setting = 111111
63 steps, 1 pF/step
Monotonic increment in capacitor value from
setting = 000000 to 111111 by design
Characterized at bench test
V
MOD depth setting = 50%
Input conditions:
Amplitude = 300 mV
Modulation depth = 80%
V
MOD depth setting = 50%
Input conditions:
Amplitude = 300 mV
Modulation depth = 80%
V
Time is measured from 10% to 90% of
amplitude
V
Time is measured from 10% to 90% of
amplitude
Time required for AGC stabilization
Equivalent to two Internal clock cycle (F
AGC stabilization time
Typically 1 T
AGC level must not change more than 10%
during T
Internal clock trimmed at 32 kHz during test
1024 cycles of RC oscillator @ F
512 cycles of RC oscillator @ F
DR
DR
DD
DD
DD
DD
DD
3.6V
+ T
- T
+85°C for industrial
+125°C for extended
= 3.0V,
= 3.0V
= 3.0V
DF
3.0V
3.0V
DF
PP
PRES
)
E
.
Conditions
PP
PP
DS41232B-page 169
OSC
OSC
OSC
)

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