P87C51MC2BA/02,529 NXP Semiconductors, P87C51MC2BA/02,529 Datasheet - Page 33

• Manufacturer Part Number: P87C51MC2BA/02,529
• Description: IC 80C51 MCU 96K OTP 44-PLCC
• Manufacturer: NXP Semiconductors
• Series: 87Cr

Specifications of P87C51MC2BA/02,529

• Program Memory Type: OTP
• Program Memory Size: 96KB (96K x 8)
• Package / Case: 44-PLCC
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 24MHz
• Connectivity: EBI/EMI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 34
• Ram Size: 3K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Processor Series: P87C5x
• Core: 80C51
• Data Bus Width: 8 bit
• Data Ram Size: 3 KB
• Interface Type: SPI, UART
• Maximum Clock Frequency: 24 MHz
• Number Of Programmable I/os: 34
• Number Of Timers: 3
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Minimum Operating Temperature: 0 C
• Cpu Family: 87C
• Device Core: 80C51
• Device Core Size: 8b
• Frequency (max): 24MHz
• Total Internal Ram Size: 3KB
• # I/os (max): 34
• Number Of Timers - General Purpose: 3
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• Instruction Set Architecture: CISC
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: PLCC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: OM10064 - EMULATOR 80C51 PDS51-MK2
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 568-1244-5; 935273219529; P87C51MC2BA/02-S

Philips Semiconductors
9397 750 12302
Product data
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These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 C
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex
foil by using a hot bar soldering process. The appropriate soldering profile can be provided on
request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Rev. 03 — 13 November 2003
P87C51MB2/P87C51MC2
10 C measured in the atmosphere of the reflow
80C51 8-bit microcontroller family
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
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