MCF53011CQT240 Freescale Semiconductor, MCF53011CQT240 Datasheet - Page 20

• Manufacturer Part Number: MCF53011CQT240
• Description: MCU 32BIT COLDFIRE EMAC 208LQFP
• Manufacturer: Freescale Semiconductor
• Series: MCF5301xr

Specifications of MCF53011CQT240

• Core Processor: Coldfire V3
• Core Size: 32-Bit
• Speed: 240MHz
• Connectivity: EBI/EMI, Ethernet, I²C, MMC, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 61
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: Cache
• Ram Size: 128K x 8
• Voltage - Supply (vcc/vdd): 1.08 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 208-LQFP
• Processor Series: MCF5301x
• Core: ColdFire V3
• Data Bus Width: 32 bit
• Data Ram Size: 128 KB
• Interface Type: UART, I2C, SPI, SSI, Ethernet
• Maximum Clock Frequency: 20 MHz to 400 MHz
• Number Of Programmable I/os: 61
• Number Of Timers: 8
• Operating Supply Voltage: 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: M53015EVB, M53017KIT, M53017MOD
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Preliminary Electrical Characteristics
5.2
The average chip-junction temperature (T
Where:
For most applications P
Solving equations 1 and 2 for K gives:
20
T
Q
P
P
P
1
2
3
4
5
Junction to ambient, natural convection
Junction to ambient (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
A
JMA
D
INT
I/O
θ
Freescale recommends the use of θ
device junction temperatures from exceeding the rated specification. System designers should be aware
that device junction temperatures can be significantly influenced by board layout and surrounding devices.
Conformance to the device junction temperature specification can be verified by physical measurement in
the customer’s system using the Ψ
EIA/JESD Standard 51-2.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8.
Board temperature is measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal
characterization parameter is written in conformance with Psi-JT.
Thermal Characteristics
JMA
and Ψ
= Ambient Temperature, °C
= Package Thermal Resistance, Junction-to-Ambient, °C/W
= P
= I
= Power Dissipation on Input and Output Pins — User Determined
jt
I/O
INT
DD
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection.
< P
× IV
+ P
INT
Characteristic
I/O
DD
and can be ignored. An approximate relationship between P
, Watts - Chip Internal Power
Preliminary—Subject to Change Without Notice
K
J
) in °C can be obtained from:
=
Table 8. Thermal Characteristics
P
jt
JmA
D
parameter, the device power dissipation, and the method described in
T
MCF5301x Data Sheet, Rev. 5
J
×
P
and power dissipation specifications in the system design to prevent
(
=
D
Four layer board
(2s2p)
Four layer board
(2s2p)
T
T
A
=
A
×
-------------------------------- -
(
+
T
273°C
(
J
P
+
D
K
273°C
×
)
Θ
+
JMA
Q
)
JMA
)
Symbol
θ
θ
×
θ
θ
Ψ
JMA
JMA
T
JB
JC
P
jt
j
2
D
MAPBGA
36
32
256
2
105
25
14
1,5
1,2
1,2
3
4
D
and T
Freescale Semiconductor
LQFP
38
33
J
208
3
105
29
11
(if P
1,5
1,2
1,2
3
4
I/O
is neglected) is:
°C / W
°C / W
°C / W
°C / W
°C / W
Unit
o
C
Eqn. 1
Eqn. 2
Eqn. 3