MCIMX515DJM8C Freescale Semiconductor, MCIMX515DJM8C Datasheet - Page 152

MULTIMEDIA PROC 529-LFBGA

MCIMX515DJM8C

Manufacturer Part Number
MCIMX515DJM8C
Description
MULTIMEDIA PROC 529-LFBGA
Manufacturer
Freescale Semiconductor
Series
i.MX51r
Datasheets

Specifications of MCIMX515DJM8C

Core Processor
ARM Cortex-A8
Core Size
32-Bit
Speed
800MHz
Connectivity
1-Wire, EBI/EMI, Ethernet, I²C, IrDA, MMC, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
128
Program Memory Type
ROMless
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
0.8 V ~ 1.15 V
Oscillator Type
External
Operating Temperature
-20°C ~ 85°C
Package / Case
529-LFBGA
Processor Series
i.MX51
Core
ARM Cortex A8
Data Bus Width
32 bit
Program Memory Size
36 KB
Data Ram Size
128 KB
Interface Type
I2C, SPI, SSI, UART, USB
Maximum Clock Frequency
200 MHz
Number Of Timers
5
Operating Supply Voltage
0.8 V to 1.15 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
MCIMX51EVKJ
Minimum Operating Temperature
- 20 C
Cpu Speed
800MHz
Digital Ic Case Style
BGA
Supply Voltage Range
0.8V To 1.15V
Operating Temperature Range
-20°C To +85°C
Leaded Process Compatible
Yes
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Package Information and Contact Assignments
4
5
5.1.2
Table 127
alpha-sorted by name.
provides a listing of the no-connect contacts.
5.1.2.1
Table 127
alpha-sorted by name.
152
NVCC_EMI_DRAM L5, M5, R5, T5, Y5, AA5
GND_ANA_PLL_A
GND_ANA_PLL_B
Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
Parallelism measurement shall exclude any effect of mark on top surface of package.
GND_DIG_PLL_A
GND_DIG_PLL_B
NGND_TV_BACK
NGND_USBPHY
Contact Name
NVCC_HS4_1
NVCC_HS4_2
NVCC_HS10
AHVDDRGB
NGND_OSC
AHVSSRGB
NVCC_IPU2
NVCC_IPU4
NVCC_IPU5
NVCC_IPU6
NVCC_HS6
NVCC_EMI
NVCC_I2C
GND
shows the device connection list for ground, power, sense, and reference contact signals
shows the device connection list for ground, power, sense, and reference contact signals
13 x 13 mm, 0.5 Pitch Ball Assignment Lists
Table 127. 13 x 13 mm Ground, Power, Sense, and Reference Contact Assignments
13 x 13 mm Ball Contact Assignments
i.MX51 Applications Processors for Consumer and Industrial Products, Rev. 4
AE2
V15, V16
V13, V14
A1, A24, A25, B1, B25, E7, E13, E16, E19, G5, J13, J14, K5, K13, K14, K15, L13, L14, L15, L21, M12,
M13, M14, M15, N5, N6, N8, N9, N10, N11, P8, P9, P11, P21, R8, R9, R10, R11, R12, T8, T9, T10, T11,
T12, T13, U5, U9, U10, U11, U12, U13, U21, W5, AA7, AA10, AA13, AA16, AA19, AD1, AD2, AD25,
AE1, AE24, AE25
AE3
AC25
AD24
AC23
AB22
L23
U8, V8
M20
L20
P20
N20
V11
V20
N16
K16
M16
Table 128
displays an alpha-sorted list of the signal assignments.
Contact Assignment
Freescale Semiconductor
Table 129

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