MC9S08RD32PE Freescale Semiconductor, MC9S08RD32PE Datasheet - Page 146

IC MCU 32K FLASH 2K RAM 28-DIP

MC9S08RD32PE

Manufacturer Part Number
MC9S08RD32PE
Description
IC MCU 32K FLASH 2K RAM 28-DIP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08RD32PE

Core Processor
HCS08
Core Size
8-Bit
Speed
8MHz
Connectivity
SCI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
23
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
28-DIP (0.600", 15.24mm)
Processor Series
S08RD
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SCI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
39
Number Of Timers
2
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 70 C
Mounting Style
Through Hole
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08RG60E
Minimum Operating Temperature
0 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S08RD32PE
Manufacturer:
Freescale Semiconductor
Quantity:
135
Serial Communications Interface (S08SCIV1)
146
EXTAL
NOTES:
XTAL
V
V
1. Port pins are software configurable with pullup device if input port
2. PTA0 does not have a clamp diode to V
3. IRQ pin contains software configurable pullup/pulldown device if IRQ enabled (IRQPE = 1)
4. The RESET pin contains integrated pullup device enabled if reset enabled (RSTPE = 1)
5. High current drive
6. Pins PTA[7:4] contain both pullup and pulldown devices. Pulldown enabled when KBI is enabled (KBIPEn = 1) and rising edge is
DD
SS
pullup is enabled.
selected (KBEDGn = 1).
(RC/RD/RE/RG32/60 = 2048 BYTES)
(RC/RD/RE/RG60 = 63,364 BYTES)
(RC/RD/RE/RG32 = 32,768 BYTES)
(RC/RD/RE8/16 = 1024 BYTES)
Figure 11-1. MC9S08RC/RD/RE/RG Block Diagram Highlighting SCI Block and Pins
(RC/RD/RE16 = 16,384 BYTES)
LOW-POWER OSCILLATOR
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
(RC/RD/RE8 = 8192 BYTES)
MODES OF OPERATION
BDC
POWER MANAGEMENT
IRQ
RTI
HCS08 CORE
REGULATOR
USER FLASH
USER RAM
VOLTAGE
CPU
COP
LVD
MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11
DD
. PTA0 should not be driven above V
INTERRUPT MODULE (KBI1)
INTERRUPT MODULE (KBI2)
INTERFACE MODULE (SCI1)
SERIAL COMMUNICATIONS
INTERFACE MODULE (SPI1)
2-CHANNEL TIMER/PWM
ANALOG COMPARATOR
CARRIER MODULATOR
TIMER MODULE (CMT)
SERIAL PERIPHERAL
MODULE (ACMP1)
8-BIT KEYBOARD
4-BIT KEYBOARD
MODULE (TPM1)
MODULE (DBG)
DEBUG
INTERNAL BUS
DD
. Also, PTA0 does not pullup to V
7
8
IRO NOTE 5
Freescale Semiconductor
PTC7/SS1
PTC6/SPSCK1
PTC5/MISO1
PTC4/MOSI1
PTC3/KBI2P3
PTC2/KBI2P2
PTC1/KBI2P1
PTC0/KBI2P0
PTA7/KBI1P7–
PTA1/KBI1P1
PTA0/KBI1P0
PTB7/TPM1CH1
PTE6
PTB5
PTB4
PTB3
PTB2
PTB1/RxD1
PTB0/TxD1
PTD6/TPM1CH0
PTD5/ACMP1+
PTD4/ACMP1–
PTD3
PTD2/IRQ
PTD1/RESET
PTD0/BKGD/MS
PTE7–
PTE0
DD
when internal
NOTE 1
NOTES1, 2
NOTES 1, 5
NOTE 1
NOTES
1, 3, 4

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